Dear friends and partners of the Fraunhofer Research Institution for Modular Solid State Technologies EMFT, dear readers,

The business year 2010/2011 has seen the start of a new phase for the Fraunhofer EMFT: after ten years as part of the Fraunhofer IZM under the direction of Prof. Dr.-Ing. Dr. h.c. Herbert Reichl, the Fraunhofer Research Institution for Modular Solid State Technologies EMFT once again became an independent Fraunhofer institution as of July 1st 2010. I would like to take this opportunity to thank Professor Reichl most warmly on behalf of all staff for his far-sighted and successful management over the past years.

With our first annual report we would like to give you an insight into the world of the new Fraunhofer EMFT and provide an impression of the spectrum of modular solid state technologies between silicon and foil.

In addition to silicon technology, 3D integration and MEMS technology as core themes at the Munich site since its beginnings more than two decades ago, multifunctional system integration has become more important to industry in recent years and therefore to the Fraunhofer EMFT, too. The integration of additional functions, where possible at wafer level, has prompted us to expand our operations in the area of Multifunctional On-Top Technologies MOTT at the Munich site since 2007, paving the way for collaborative ventures with industrial partners in this domain. Controller modules with MOTT-integrated sensors, detectors with MOTT-integrated driver transistors and silicon MEMS micropumps with integrated control electronics are practical examples of the current range of applications, giving some idea of the diverse potential offered by the MOTT concept.

There has also been a major shift in research in the area of assembly and interconnection technology, another key focus area of the Fraunhofer EMFT with a longstanding tradition. In view of rising demands such as multifunctionality, reliability, low energy consumption, environmental compatibility and production costs, the packaging is increasingly becoming a technology which will be very similar to today's semiconductor technologies.

For example, the use of self-assembly techniques – like those which occur in nature - offers fascinating options for the future assembly of tiny chips.

Polytronics, a relatively recent and highly innovative research field at the Fraunhofer EMFT, has moved on from being an area of pre-competitive research into the application-oriented development phase over the last ten years. Innovative additive structuring processes such as ink jet or screen printing, nanoimprint and microcontact printing create the basis for the use of foil substrates in a range of sophisticated sensor applications, opening up new application scenarios in medical technology, navigation, IT and telecommunications engineering.

Here, foil technologies happily dovetail with classic silicon and MEMS technologies. It is already apparent that modular combination will offer significant benefits, especially in the field of multifunctional system integration and 3D system integration.

Our first year as the Fraunhofer EMFT has shown that as a team we are able to tackle the demanding work and challenges that face us, achieve our goals and develop our institution along the lines of our guiding theme, that of modular solid state technologies. I offer my sincere thanks to our entire team of staff for their exemplary dedication and commitment.

I now hope to have aroused your curiosity for a more detailed look at modular solid state technologies and wish you a stimulating and informative read. I would very much encourage you to contact us directly.

Prof. Dr.-Ing. Karlheinz Bock

Acting Director of the
Fraunhofer Research Institution for Modular Solid State Technologies EMFT


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