Publikationen in 2010

Verzeichnis

P. Ramm, A. Klumpp, J. Weber, N. Lietaer, M. Taklo, W. De Raedt, T. Fritzsch, P. Couderc
3D Integration Technology: Status and Application Development
Joint Plenary Keynote Talk
Proc. ESSCIRC / ESSDERC 2010 Sevilla, Spain, p. 9-16
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P. Ramm
The European 3D Technology Platform for Heterogeneous Systems
Opening Keynote Talk
Proc. Int. Wafer-Level Packaging Conference IWLPC 2010, Santa Clara, USA
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P. Ramm, A. Klumpp, J. Weber, M. Taklo, N. Lietaer, W. De Raedt, T. Fritzsch, T. Hilt,
P. Couderc, C. Val, A. Mathewson, K. M. Razeeb, F. Stam
The European 3D Technology Platform (e-CUBES)
Future Fab International, Issue 34 (2010)
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C. Landesberger, S. Scherbaum, K. Bock
Ultra-thin Wafer Fabrication Through Dicing-by-Thinning
Joachim N. Burghartz (editor), Ultra-thin Chip Technology and Application, S. 33-43, Springer, Berlin, 2010, ISBN 978-1-4419-7275-0
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C. Landesberger, S. Scherbaum, K. Bock
Substrate Handling Techniques for Thin Wafer Processing
Joachim N. Burghartz (editor), Ultra-thin Chip Technology and Application, S. 125-138, Springer, Berlin, 2010, ISBN 978-1-4419-7275-0
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C. Landesberger, S. Scherbaum, C. Paschke, K. Bock
Proving the robustness of thin silicon
Workshop Thin Semiconductor Devices, München, 1.-2.12.2010 , 2010
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C. Landesberger, I. Balaj
Thin Wafer Processing and Electrostatic Carrier Technology
Tutorial at IEEE 3D System Integration Conference, Munich, November 16-18, 2010
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C. Landesberger, E. Yacoub-George, W. Hell, K. Bock
Self-assembly and self-interconnection of thin RFID devices on plasma-programmed foil substrates
Electronics System Integration Technology Conference ESTC; September 13-16, 2010; Berlin, Germany
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H.Stieglauer1, J.Nösser1, A.Miller1, M.Lanz1, D.Öttlin1, G.Jonsson1, D.Behammer1, C.Landesberger2, H.-P. Spöhrle2, K.Bock2
1) United Monolithic Semiconductors UMS, 89081 Ulm, Germany
2) Fraunhofer Research Institution for Modular Solid State Technologies EMFT, Hansastrasse 27d,
80686 München, Germany.

Mobile electrostatic carrier (MEC) evaluation for a GaAs wafer backside manufacturing process
Conference on Compound Semiconductors Manufacturing Technology, Portland, Oregon May 17- 20, 2010
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M. Schlosser, P. Iskra, U. Abelein, H. Lange, H. Lochner, T. Sulima, F. Wiest, T. Zilbauer, B. Schmidt, I. Eisele, W. Hansch
The Impact Ionization MOSFET (IMOS) as low-voltage optical detector
Nuclear Instruments and Methods in Physics Research A 624 (2010) p. 524-527
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M. Herz1, D. Horsch1, R. Storch2, M. Wackerle1, T. Lueth3, M. Richter1
1) Fraunhofer Research Institution for Modular Solid State Technologies EMFT,  Munich
2) PariTec GmbH, Munich
3) MIMED Department of Micro Technology and Medical Device Engineering, Technical University Munich
Modeling, Fabrication and Characterization of a High-Performance Micropump
Micro-Fluidic Components and Systems
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A. Ohlander, C. Strohhöfer, K. Bock, S. M. Scott, Z. Ali, Peter Musil, Jan Kyselovic
Assembly of a Polymer Lab-on-chip Device for Impedimetric Measurements of D-dimers in Whole Blood
60th ECTC Konferenz, Las Vegas, Nevada, 1-4 Juni 2010
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Thomas Velten1, Frank Bauerfeld1, Herbert Schuck1, Sabine Scherbaum2, Christof Landesberger2, Karlheinz Bock2
1) Fraunhofer Institute for Biomedical Engineering (IBMT), Ensheimer Strasse 48, 66386 St. Ingbert, Germany
2) Fraunhofer Research Institution for Modular Solid State Technologies EMFT, Munich, Germany
Roll-to-Roll Hot Embossing of Microstructures
Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS, DTIP, May 5-7, 2010, Sevilla, Spain
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C. Landesberger, E. Yacoub-George, W. Hell, K. Bock
Self-assembly and self-interconnection of thin RFID devices on plasma-programmed foil substrates
Electronics System Integration Technology Conference ESTC; September 13-16, 2010; Berlin, Germany
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Horst A. Gieser, Detlef Bonfert, Horst Hengelmann, Heinrich Wolf, Karlheinz Bock, Volker Zöllmer, Christian Werner, Gerhard Domann, Joachim Bahr, Ivan Ndip, Brian Curran, Frank Oehler, Heinrich Milosiu
Rapid Prototyping of Electronic Modules Combining Aerosol Printing and Ink Jet Printing
Fraunhofer EMFT, IFAM, ISC, IZM, IIS, TU-Berlin
Electronics System Integration Technology Conference ESTC, September 13 – 16, 2010, Berlin
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Bonfert, D.; Gieser, H.; Bock, K., Svasta, P; Ionescu
Pulsed stress behavior of platinum thin films
2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME), Sept. 2010, Pitesti Romania, Pages: 83-8
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Falat, T.; Felba, J.; Moscicki, A., Smolarek, A., Bock, K., Bonfert, D.
Influence of nano silver filler content on properties of ink-jet printed structures for microelectronics
2010 3rd Electronic System-Integration Technology Conference (ESTC 2010), Sept. 2010, Berlin Germany
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Bonfert, D.; Klink, G.; Gieser, H., Svasta, P; Ionescu
Electrical stress on film resistive structures on flexible substrates
2010 3rd Electronic System-Integration Technology Conference (ESTC 2010), Sept. 2010, Berlin Germany, Pages: 6 pp.
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Ionescu, C.; Svasta, P.; Bonfert, D., Klink, G.
Analysis of planar inductors on flexible substrates for RFID antennas
2010 33rd International Spring Seminar on Electronics Technology (ISSE 2010), May 2010, Warsaw Poland, Pages: 338-43
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Bonfert, D.; Klink, G.; Bock, K.
Polymer electronics towards system integration
2010 33rd International Spring Seminar on Electronics Technology (ISSE 2010), May 2010, Warsaw Poland, Pages: 1-6
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Wolf, H.
CDM Charged Device Model Test: Current Status and Possible Alternatives
Seminar at the 4. International ESD-Workshop, Tutzing, Germany, Mai 2010
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Gieser, H.
Design and Application of VF-TLP and of CC-TLP Systems targeted for CDM
Tutorial at the EOS/ESD-Symposium in South Lake Tahoe, NV, USA, October 2010