Publikationen in 2011

Verzeichnis

März A., Trupp S., Rösch P., Mohr G. J., Popp J.
Fluorescence dye as novel label molecule for quantitative SERS investigations of an antibiotic
ANALYTICAL AND BIOANALYTICAL CHEMISTRY, DOI:  10.1007/s00216-011-5273-z, 2011
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Escudero D.; Trupp S.; Bussemer B.; et al.,
Spectroscopic Properties of Azobenzene-Based pH Indicator Dyes: A Quantum Chemical and Experimental Study
JOURNAL OF CHEMICAL THEORY AND COMPUTATION Volume: 7 Issue: 4 Pages: 1062-1072 DOI: 10.1021/ct1007235
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Lars Nebrich
Der Röntgenblick entdeckt gefährliche Stoffe
VDI-Nachrichten; 16. Dezember 2011
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E. Yacoub-George, K. Bock
3D-Integrationstechnologien zur Herstellung mikroelektronischer Foliensysteme
Symposium Netzwert 2011, Munich, Germany, 28-29 November 2011
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C. Landesberger, R. Wieland, K. Bock
Mobile electrostatic carriers – status and perspectives
Forum be-flexible 2011; Munich, Germany; 23-24 November 2011
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E. Yacoub-George, K. Bock
On foil integration and foil to foil assembly in flexible electronics
Forum be-flexible 2011; Munich, Germany; 23-24 November 2011
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E. Yacoub-George, K. Bock
3D-Integration Technologies for the Fabrication of Flexible Foil Systems
3rd Flexible & Stretchable Electronics Workshop 2011; Berlin, Germany; 15-17 November, 2011
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Peter Ramm
Issues for 3D-TSV Production
Panel “3D Infrastructure Issues for Technology Adoption”, International Wafer-Level Packaging Conference – IWLPC 2011, Santa Clara, California (October 2011)
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E. Yacoub-George, H. E. Endres, R. Faul, K. Bock, A. Kugler, M. Mahlich, M. Koyuncu
Interconnection technologies for a multilayer system in foil
Plastic Electronics 2011; Dresden, Germany, 11-13 October 2011
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Gerhard Klink
Manufacturing and Production Equipment for Printed and Polymer Electronics
ISFOE 2011 Proceedings
Int. Symp. On Flexible and Organic Electronics, Thessaloniki, Greece, 10.-13.7.2011
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Gerhard Klink
COSMIC – Challenges and Progress
ISFOE 2011 Proceedings
Int. Symp. On Flexible and Organic Electronics, Thessaloniki, Greece, 10.-13.7.2011
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Pietro Valdastri, Ekawahyu Susilo, Thilo Förster, Christof Strohhöfer, Arianna Menciassi, Paolo Dario
Wireless Implantable Electronic Platform for Chronic Fluorescent-Based Biosensors
IEEE Transactions on Biomedical Engineering 58 (6), June 2011
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Waqas M Syed
Organic Schottky Diodes based on Pentacene Derivatives
Proceedings of LOPE-C 2011
Large-area, organic and printed electronics convention LOPE-C, Frankfurt am Main, 28.-30.6.2011
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E. Yacoub-George, K. Bock
Hetero-integration of foil components and printed circuit foils for flexible electronics
EMFT SummerSchool 2011, Munich, Germany, 07-10 June 2011
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Anna Ohlander, M. Burghart, Ch. Strohhöfer, D. Bollmann, Ch. Landesberger, G. Klink, K. Bock
Polymer opto-electronic-fluidic detection module on plastic film substrates
Proceedings of ECTC
ECTC 2011, 31.5. – 2.6.2011, Lake Buena Vista (FL), USA
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Armin Klumpp, Peter Ramm, German Franz, Chad Rue, Laurens Kwakman
Reliability Testing and Failure Analysis of 3D Integrated Systems
Proc. Interconnect Technology Conference - IITC 2011 (May 2011)
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Lars Nebrich, Harry Hedler, Reinhard Fojt
Detektoren für Tomographie mit Positronen
Kooperationsforum Bayern-Innovativ; München, Deutschland, 10. Mai 2011
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L. Andricek, M. Beimforde, A. Klumpp, A. Macchiolo, K.-R. Merkel, H.-G. Moser, R. Nisius, R.H. Richter, J. Weber, P. Weigell, and R. Wieland
Application of the SLID-ICV Interconnection Technology for the ATLAS Pixel Upgrade at SLHC
Proc. IEEE 3D System Integration Conference – 3DIC 2010, Munich, Germany, Editors: Peter Ramm and Eric Beyne (April 2011)
http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=5751439&tag=1
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Harry Hedler, Thomas Scheiter, Markus Schieber, Armin Klumpp and Peter Ramm
High Performance 3D Interconnects Based on Electrochemical Etch and Liquid Metal Fill
Proc. IEEE 3D System Integration Conference – 3DIC 2010, Munich, Germany, Editors: Peter Ramm and Eric Beyne (April 2011)
http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=5751449
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Peter Ramm, Armin Klumpp, German Franz, Laurens Kwakman
Failure Analysis and Reliability of 3D Integrated Systems
Proc. Int. Conf. Device Packaging Imaps 2011, Scottsdale, USA (March 2011)
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E. Yacoub-George, A. Ohlander, L. Meixner, D. Bollmann, R. Faul, C. Landesberger, K. Bock
Large area multilayer foil assembly for flexible electronic systems
Smart Systems Integration 2011; Dresden, Germany, 22-23 March 2011
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Lars Nebrich, Reinhard Fojt
"Optische und Röntgendetektoren"
Kooperationsforum "Mensch und Mikrosysteme"; München, Deutschland; 16. Februar 2011
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C. Landesberger, C. Paschke, K. Bock
Influence of wafer grinding and etching techniques on the fracture strength of thin silicon substrates
Advanced Materials Research Vol 325 (2011), pp 659-665
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T. Velten, F. Bauerfeld, H. Schuck, S. Scherbaum, C. Landesberger, K. Bock
Roll-to-roll hot embossing of microstructures
Microsystem Technologies (2011) 17, pp 619-627
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C. Landesberger, A. Klumpp, K. Bock
Temporary Bonding: Electrostatic; in: Handbook of Waferbonding
editors: P. Ramm, J. Lu, M. Taklo
pp 367-383; Wiley, 2011
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Christof Strohhöfer, T. Förster, D. Chorvat, P. Kasak, I. Lacık, M. Koukaki, S. Karamanou and A. Economou
Quantitative analysis of energy transfer between fluorescent proteins in CFP–GBP–YFP and its response to Ca2+
Phys. Chem. Chem. Phys., 2011, 13, 17852–17863