Publikationen in 2013

Veröffentlichungen

Peter Ramm, Maaike Taklo, Maximilian Fleischer, Adrian Ionescu, Armin Klumpp,
Reinhard Pufall
The e-BRAINS Project
Proceedings ESSDERC/ESSCIRC 2013, Workshop „In the Quest for Zero Power”,
October 18, 2013

Wolf, H.; Gieser, H.; Maurer, L.
Transmission Lines on Flexible Substrates with Minimized Dispersion and Losses
Proceedings of the 8th European Microwave Integrated Circuits Conference EuMIC,
6.- 8. Oct. 2013, Nuremberg, Germany, pp. 448-451

Ramm, P.
The common ground of interposer and 3D integration technology
Future Fab International, Issue 45, April 2013

Ohlander, A.; Zilio, C.; Hammerle, T.; Zelenin, S.; Klink, G.; Chiari, M.; Bock, K.; Russom, A.
Genotyping of Single Nucleotide Polymorphisms by meltin curve analysis using thin film semi-transparent heaters integrated in a lab-on-foil system
Lab-on-Chip Journal, 2013, 13 (11), pp. 2075 - 2082

Alberti, M.; Meixner, L.; Rückerl, A.; Eder, M.; Endres, H.-E., Bock, K.
"Sensor Filter" - Intelligent micro filter system in foil technology
Sensors and Actuators A: Phys. (2013)

Pufall, R.; Goroll, M.; Taklo, M.V.; Ramm, P.
Lessons learned from the European research project e-BRAINS
An overview of activities and results on methodology of reliability and robustness
Proc. International Conference MicroCar, February 2013

Vorträge

Landesberger, C., Yacoub-George, E., Bock, K.
Modular System Integration on Flexible Film Substrates
Forum Be-Flexible, München, 20. November 2013

Ohlander, A.; Bauer, S.; Ramachandraiah, H.; Russom, A.; Bock, K.
Foil-based DNA Melting Curve Analysis Platform for low-cost Point-of-Care Molecular Diagnostics
uTAS Konferenz 2013, Freiburg, 27-30 Oktober 2013

Ramm, P.
3D Integration Technology For RF MEMS
IEEE International 3D System Integration Conference 3DIC, San Francisco, USA, Oktober 2013

Bonfert, D.; Hemmetzberger, D.;  Klink, G.; Bock, K.; Svasta, P.; Ionescu, C.
Sensing Properties of Carbon Nanotube Based Thick Film Layers on Foils
SIITME 2013 Konferenz, Galata, Romania, 24.-27. Oktober 2013

Topak, E.; Choi, J.-Y.; Merkle, T.; Koch, S.; Saito, S.; Landesberger, C.; Faul, R.; Bock, K.
Broadband Interconnect Design for Silicon-based System-in-Package Applications up to 170 GHz
European Microwave Week 2013, Nürnberg, 6.-11. Oktober 2013

Maaike Taklo, Peter Ramm, Maximilian Fleischer, Adrian Ionescu, Reinhard Pufall
European Activities in Heterogeneous Sensor Integration (e-BRAINS)
IEEE Int. 3D System Integration Conference – 3DIC 2013, October 3, San Francisco, USA

Montserrat Fernández-Bolaños, Peter Ramm, Reinhard Pufall, Elizabeth Buitrago, Christian Zilch, Hoël Guerin, Hélène Le Poche, Roland Pohle, Alexandru Popescu and Adrian M. Ionescu
3D Heterogeneous Integration for Nanosensor Systems - the EU-Project e-BRAINS
Int. Conference on Solid State Devices and Materials – SSDM 2013 , September 27, Fukuoka, Japan

Klink, G.
Towards Roll-to-Roll Fabrication of Electronic Functions on Plastic Films
EuroDisplay 2013, Organic Electronics Workshop, London, 16. September 2013

Trupp, S.
Anwendungen von Nanosensoren - von der Zelle bis zum Flächensensor
Fraunhofer-Tag "Mikroverkapselung und Partikelanwendungen", München, 4. Juli 2013

Kutter, C.
Anleitung für KMUs – Wie baue ich einen Sensor
Innovations in Microsystems, München, 25.-26. Juni 2013

Kutter, C.
Sensors and actuators for humans and the environment
Infineon Seminar, München, 20. Juni 2013

Trupp, S.
Sensor textiles - visualize things that matter
Techtextil- & Avantex Symposium 2013, Frankfurt am Main, 11.-13. Juni 2013

Bock, K.
Heterointegration technologies for high frequency modules based on film substrates
Compound Semiconductor Manufacturing Technologies, CSMANTECH 2013, New Orleans USA, Vereinigte Staaten Int., 13.-17. Mai 2013

Bonfert, D.; Hemmetzberger, D.; Klink, G.; Bock, K.; Svasta, P.; Ionescu, C.
Electrical Stress on Transparent Conductive Oxide Layer
ISSE Konferenz 2013, Alba Iulia, Rumänien, 8.-12. Mai 2013

Bock, K.; Bose, R.I.; Klink, G.; Landesberger, C.; Ohlander, A.; Yacoub-George, E.
Multifunctional System Integration in Flexible Substrates
IEEE International Conference on Robotics and Automation, Karlsruhe, 6.-10. Mai 2013

Bock, K.
Multifunctional System Integration in Flexible Substrates 
IEEE ICRA International Conference on Robotics and Automation ICRA 2013, SMART SKIN Workshop, Karlsruhe, Deutschland, 06.-09. Mai 2013

Bock, K.
Heterointegration of Smart Systems by Co-Integration of Materials and Processes
Int. Conf. on Smart Structures (SSC) 2013, San Diego, USA, 11.-15. März 2013 SPIE

Boudaden, J.
CO2 Sensor system for mobile applications
Smart Systems Integration Conference, Amsterdam, The Netherlands, 13.-14. März 2013

Wieland, R.
MEMS-Microphone
Smart Systems Integration Conference, Amsterdam, The Netherlands, 13.-14. März 2013

Yacoub-Geroge, E.; Faul, R.; Bock, K.
Interflex: Reliable integration technologies for building a system-in-foil
Smart Systems Integration Conference, Amsterdam, The Netherlands, 13.-14. März 2013

Klink, G.
Heterointegration Technologies on Plastic Films
Generative Fertigungsverfahren in Elektronik, Oberpfaffenhofen, 12.-13. März 2013

Ramm, P.
3D-Integration - Technologie und Anwendungen
Technische Universität München, Oberseminar Elektrophysik, 4. Februar 2013

Kutter, C.
Mikrosensorik – intelligente und materialsparende Sensor-Systeme
Cluster Sensorik, Technologieforum Sensorik: Materialeffizienz, Regensburg, 30. Januar 2013

Kutter, C.
European Semi Industrie – Trends and Challenges
McKinsey Semiconductor Practice, 18. Januar 2013