Publikationen in 2014

Veröffentlichungen

Peter Schneider, Andy Heinig, Christian Bayer, Renzo Dal Molin, Maximilian Fleischer, Peter Ramm
Technology, Simulation and Design for 3D Integrated Heterogeneous Sensor Systems
Proc. 3D ASIP 2014, Burlingame, Dezember 2014

Nastasi, G.A.M.; Scuderi, A.; Endres, H.-E.; Hell, W.; Bock, K.
Simple Cost Effective and Network Compatible Readout for Capacitive and Resistive (Chemical) Sensors
Procedia Engineering 87, S. 1234–1238. DOI: 10.1016/j.proeng.2014.11.406.

P. Ramm, P. Schneider, R. Dal Molin
3D Heterogeneous System Integration
Chip Scale Review Magazin, November 2014

Vincenzo Fiore, Placido Battiato, Sahel Abdinia, Stephanie Jacobs, Isabelle Chartier, Romain Coppard, Gerhard Klink, Eugenio Cantatore, Egidio Ragonese, Giuseppe Palmisano
A Comprehensive Solution for a 13.56-MHz RFID Tag in an Organic Complementary TFT Technology on Flexible Substrate
IEEE-CMDT, November 2014

C. W. Jenke, M. Köhn, M. Wackerle, C. Kutter, M. Richter
Dynamic behavior of a piezoelectric micropump actuator
2nd International Conference on MicroFluidic Handling Systems, University of Freiburg, Germany, 8. - 10. Oktober 2014

U. Zschenderlein, D. Vogel, E. Auerswald, O. Hölck, H. Rajendran, P. Ramm, R. Pufall, B. Wunderle
Residual Stress Investigations at TSVs in 3D Micro Structures by HR-XRD, Raman Spectroscopy and fibDAC
IEEE Xplore, ECTC, Orlando, USA, September 2014

I. Bose, K. Tetzner, K. Borner, K. Bock
Air-stable, high current density, solution-processable, amorphous organic rectifying diodes (ORDs) for low-cost fabrication of flexible passive low frequncy RFID tags
Journal of Microelectronics Reliability, Berlin, September 2014

M.M.V. Taklo, K. Scholberg-Henriksen, H.R. Tofteberg, N. Malik, D.O. Vella, J. Borg, A. Attard, Z. Hajdarevic, A. Klumpp and P. Ramm
Crossover of knowledge between bonding of MEMS and 3DIC
IEEE Xplore, LTB-3D, Tokyo, Juli 2014

C.W. Jenke, S. Kibler, Y. Gao, A. Hollot, T. Neuhann, B. Kirchhof, B. Montag, M. Geiger, J. Neitzel, C. Kutter, M. Richter
Optimization of a Piezoelectric Micropump Actuator for Medical Application in Glaucoma and Phthisis Therapy
ACTUATOR 2014, 14th International Conference on New Actuators, Bremen, Germany,
23. – 25. Juni 2014

Kornelius Tetzner, Indranil Ronnie Bose, Karlheinz Bock
Organic field-effect transistors based on a liquid-crystalline polymeric semiconductor using SU-8 gate dielectrics on flexible substrates
Synthetic Metals: The Journal of Electronic Polymers and Electronic Molecular Metals, Juni 2014

K. Bock, E. Yacoub-George, W. Hell, A. Drost, H. Wolf, D. Bollmann, C. Landesberger, G. Klink, H. Gieser, C. Kutter
Multifunctional System Integration in Flexible Substrates
The IEEE 64th Electronic Components & Technology Conference, 27.-30. Mai 2014, Lake Buena Vista , FL, U.S.A.
IEEE Catalog Number: CFP14ECT-USB, ISBN: 978-1-4799-2406-6

D. Vogel, U. Zschenderlein, E. Auerswald, O. Hölck, P. Ramm, B. Wunderle, R. Pufall
Determination of residual stress with high spatial resolution at TSVs for 3D integration: Comparison between HR-XRD, Raman spectroscopy and fibDAC
IEEE Xplore, eurosime, Belgium, Mai 2014

Damian Dudek, DFG, Bonn, Gerhard P. Fettweis, TU Dresden, Lothar Frey, Fraunhofer IISB, Erlangen, Dietmar Kissinger, Universität Erlangen-Nürnberg, Christoph Kutter, Fraunhofer EMFT, München, Wolfgang Mathis, Universität Hannover, Paolo Lugli, TU München, Peter Russer, TU München, Robert Weigel, Universität Erlangen-Nürnberg, Ingo Wolff, IMST GmbH, Kamp-Lintfort
VDE-Positionspapier "Hidden Electronics"
Verband der Elektrotechnik Elektronik Informationstechnik e.V., Frankfurt am Main, April 2014

C. Brecher, J.M.Ellinghaus, M.Fleger, M.Holzer, B.Meiers, C.Wald, C.Wenzel
Mikrostrukturen für autarke Systeme der Zellkultivierung
MIKROvent GmbH, MIKROPRDUKTION 04/14, p.30 – p35, April 2014

Rozalia Beica, Jean-Christophe Eloy, Peter Ramm
Key Applications and Market Trends for 3D Integration and Interposer Technology
Handbook of 3D Integration, Vol. 3, Wiley-VCH, 2014 (ISBN: 978-3-527-33466-7)

Christof Landesberger, Christoph Paschke, Hans-Peter Spöhrle, Karlheinz Bock
Backside Thinning and Stress-Relief Techniques for Thin Silicon Wafers
Handbook of 3D Integration, Vol. 3, Wiley-VCH, 2014 (ISBN: 978-3-527-33466-7)

Philip Garrou, Peter Ramm, Mitsumasa Koyanagi
3D IC Integration
Handbook of 3D Integration, Vol. 3, Wiley-VCH, 2014 (ISBN: 978-3-527-33466-7)

Christof Landesberger, Mitsuru Hiroshima, Josef Weber, Karlheinz Bock
High-Accuracy Self-Alignment of Thin Silicon Dies on Plasma-Programmed Surfaces
Handbook of 3D Integration, Vol. 3, Wiley-VCH, 2014 (ISBN: 978-3-527-33466-7)

James J.-Q. Lu, Dingyou Zhang, Peter Ramm
Overview of Bonding and Assembly Technologies and Assembly for 3D Integration
Handbook of 3D Integration, Vol. 3, Wiley-VCH, 2014 (ISBN: 978-3-527-33466-7)

Philip Garrou, Mitsumasa Koyanagi and Peter Ramm (Eds.)
Handbook of 3D Integration, Volume 3: 3D Process Technology
Wiley VCH, ISBN 978-3-527-33466-7, Weinheim, 2014

Vorträge

P. Schneider, A. Heinig, C. Bayer, R. Dal Molin, M. Fleischer, P. Ramm
Technology, Simulation and Design for 3D Integrated Heterogeneous Sensor Systems
Invited Talk @3D ASIP Conference, Burlingame, USA, 8. - 10. Dezember 2014

C. Kutter
Flexible Printed Electronics as Enabler for Trillion Sensor Applications, Trillion Sensor Summit
Tokyo, 8. - 9. Dezember 2014

D. Borggreve
Design of Analog-to-Digital Converters in 28 nm FD-SOI CMOS Technology
YHTA (Young HTA) Session, St-Martin d’Uriage, France,
12. - 14. November 2014

C. Kutter
Status Quo: Science Community
Electronica 2014, MEMS-Forum: Internet of Things, München,
11. November 2014

A. Ohlander, Th. Ganka, T. Binder, F. Wiest, A. Russom, K. Bock
Real-time Monitoring of Melting Curves on DNA Microarrays in Plastic Lab-on-Foil System Using Silicon Photomultiplier Detectors
MicroTAS Conference, San Antonio, Texas, USA,  26. - 30. Oktober 2014

N. Palavesam, C. Landesberger, K. Bock
Investigations of the Fracture Strength of Thin Silicon Dies Embedded in Flexible Foil Substrates
SIITME Conference, Bucharest, Romania, 23. - 26. Oktober 2014

Indranil Bose, Detlef Bonfert, Sebastian Heim, Karlheinz Bock
Low cost, rigid to flex interposer using a spray coated intrinsically conductive polymer in a roll to-roll process
SIITME Conference, Bucharest, Romania, 23. - 26. Oktober 2014

S. Kibler, L. Hassan, M. Richter, C. Kutter
Feedback controlled microdosing system for nanoliter per second dosing rates using a capacitive phase boundary time-of-flight flow sensor
2nd International Conference on MicroFluidic Handling Systems, University of Freiburg, Germany, 8. - 10. Oktober 2014,

Julia Sporer
Sensormaterialien und Sensorsysteme an der Fraunhofer EMFT
Fraunhofer Institut für Arbeitsschutz IFA, St. Augustin, 1. Oktober 2014

G.A.M. Nastasi, A. Scuderi, H.-E. Endres, W. Hell, K. Bock
Simple, cost effective and network compatible readout for capacitive and resistive (chemical) sensors
Eurosensors 2014, Brescia, Italia, 8. - 10. September 2014

A. Ohlander, S. Bauer, H. Ramachandraiah,  A. Russom, K. Bock
Microfluidic Detection Module For DNA Analysis Using Integrated Microheaters And DNA Microarrays On Plastic Foil
ITG-GMA Fachtagung Sensoren und Messsysteme 2014, Nürnberg, 3. - 5. Juni 2014

S. Kibler, M. Richter, B. Möller, C. Kutter
Geregelte Mikroschmierung von Präzisionslagern in Hochleistungsspindeln mittels kapazitiver Dosierüberwachung
ITG-GMA Fachtagung Sensoren und Messsysteme 2014, Nürnberg, 3. - 5. Juni 2014

K. Bock, E. Yacoub-George, W. Hell, A. Drost, H. Wolf, D. Bollmann, C. Landesberger, G. Klink, H. Gieser, C. Kutter
Multifunctional System Integration in Flexible Substrates
The IEEE 64th Electronic Components & Technology Conference, Lake Buena Vista , FL, U.S.A., 27. -30. Mai 2014

Erwin Yacoub-George, Andreas Drost, Dieter Hemmetzberger, Dieter Bollmann, Robert Faul, Karlheinz Bock
Interflex: challenges and solutions to fabricate a double-sided wiring layer for a “system in foil”
Smart Systems Integration Conference, Vienna, Austria, 26. - 27. März 2014

Ramm, P.
Heterogeneous Sensor Integration for Smart Ambient Intelligence Systems
e-BRAINS Workshop on Heterogeneous 3D integration of sensors and circuits for Smart Microsystems, Lausanne, Switzerland, 17. Februar, 2014

Europe in 3D: The Brains behind e-BRAINS (Interview with Reinhard Pufall, Maximillian Fleischer, and Peter Ramm)
3D InCites
Stirring up interest in 3D IC technology and 3D integration, Januar 2014