Publikationen in 2015

Veröffentlichungen

Andy Heinig, Muhammad Waqas Chaudhary, Peter Schneider, Josef Weber, Peter Ramm
Current and Future 3D Activities at Fraunhofer
IEEE Xplore, Proc. 3DIC, Sendai, Japan, Dezember 2015

T. Lim, Ph. Benech, J. Jimenez, J.-M. Fournier, B. Heitz, J. Bourgeat, Ph. Galy
Generic Electrostatic Discharges Protection Solutions for RF and Millimeter-Wave Applications
IEEE Transactions on Microwave Theory and Techniques, vol. 63, no. 11, pp. 3747-59, November 2015

Heinrich Wolf
In-Situ Measurements of Stress Currents During System Level ESD Tests
ESD-Forum, München, Deutschland, 5. - 6. November 2015

Stefan Seidl, Kai Esmark, Friedrich zur Nieden, Reinhold Gärtner, Heinrich Wolf, Horst Gieser
Beurteilung der CDM-Festigkeit mittels CC-TLP
ESD-Forum, München, Deutschland, 5. - 6. November 2015

C.W. Jenke, T. Muster, M. Richter, C. Kutter
Partikeltoleranz von Mikromembranpumpen mit geringer Kammer-höhe und passiven Klappenventilen
MikroSystemTechnik Kongress 2015, Karlsruhe, Deutschland, 26. - 28. Oktober 2015
ISBN 978-3-8007-4100-7, pp. 489-492

A. Artelsmair, M. Wackerle, M. Richter, F. Irlinger
Simulation und Charakterisierung einer bi-direktionalen Dreikammermikropumpe aus Edelstahl
MikroSystemTechnik Kongress 2015, Karlsruhe, Deutschland, 26. - 28. Oktober 2015
ISBN 978-3-8007-4100-7, pp. 467-470

C. Wald, M. Richter
Low-Cost Edelstahl-Mikropumpe zur Probenzufuhr eines miniaturisierten Gassensorsystems zur Brandfrüherkennung
MikroSystemTechnik Kongress 2015, Karlsruhe, Deutschland, 26. - 28. Oktober 2015
ISBN 978-3-8007-4100-7, pp. 448-451

Indranil Bose, Kornelius Tetzner, Kathrin Borner, Karlheinz Bock
Homogeneous Crystallization of Micro-DispensedTIPS-Pentacene Using a Two-Solvent System toEnable Printed Inverters on Foil Substrates
Electronics 2015, 4, 565-581; doi:10.3390/electronics4030565

Vincenzo Fiore, P. Battiato, S. Abdinia, S. Jacobs, I. Chartier, R. Coppard, G. Klink, E. Cantatore, E. Ragonese, G. Palmisano
An Integrated 13.56-MHz RFID Tag in a Printed Organic Complementary TFT Technology on Flexible Substrate
IEEE Transactions on Circuits and Systems I, 62 (2015), p. 1668 – 1677, DOI: 10.1109/TCSI.2015.2415175

T. Lim, L. Santarelli, F. Cacialli, H. Gieser
Electrostatic discharge sensitivity investigation on organic field-effect thin film transistors
13th IEEE International NEW Circuits And Systems Conference, Grenoble, France, 
7. - 10. Juni 2015

Wolfgang A. Vitale, Montserrat Fernández-Bolaños, Robert Wieland, Josef Weber, Peter Ramm, Adrian M. Ionescu   
Ultra fine-pitch TSV technology for ultra-dense high-Q RF inductors
2015 Symposium on VLSI Technology & Circuits, Kyoto, Japan, 16.-19. Juni 2015

Vitale, Wolfgang A.; Fernandez-Bolanos, Montserrat; Merkel, Reinhard; Enayati, Amin; Ocket, Ilja; De Raedt, Walter; Weber, Josef; Ramm, Peter; Ionescu, Adrian M.
Fine pitch 3D-TSV based high frequency components for RF MEMS applications
Electronic Components and Technology Conference (ECTC), 2015 IEEE 65th,
vol., no., pp.585,590, 26. - 29. Mai 2015, DOI: 10.1109/ECTC.2015.7159650

Peter Ramm, Armin Klumpp, Josef Weber, Alan Mathewson, Kafil M. Razeeb, Reinhard Pufall
The European 3D Heterogeneous Integration Platform (e-BRAINS) – a Particular Focus on Reliability and Low-Temperature Processes for 3D Integrated Sensor Systems
Proceedings IMAPS Device Packaging Conference, Scottsdale, USA, 17.-19. März 2015

Wolfgang A. Vitale, Montserrat Fernández-Bolaños, Reinhard Merkel, Amin Enayati, Ilja Ocket, Walter De Raedt, Josef Weber, Peter Ramm and Adrian M. Ionescu
Fine Pitch 3D-TSV Based High Frequency Components for RF MEMS Applications
ECTC 2015, San Diego, USA, 27. Februar 2015

Christian Götz
PEDOT/PSS als transparentes Elektrodenmaterial für impedimetrische Whole-Cell Biosensoren
9. Interdisziplinäres Doktorandenseminar - Chemo- und Biosensoren in der Prozessanalytik, Berlin, Deutschland, Februar 2015

Julia Sporer
Development of a Sensor Strip and Intelligent Protective Clothing for Carbon Monoxide
9. Interdisziplinäres Doktorandenseminar - Chemo- und Biosensoren in der Prozessanalytik, Berlin, Februar 2015

Romy Freund
Untersuchungen zur Phototoxizität von bioanalytisch-relevanten Fluorophoren mit label-freien Whole-Cell Biosensoren
9. Interdisziplinäres Doktorandenseminar - Chemo- und Biosensoren in der Prozessanalytik, Februar 2015

Peter Ramm
Heterogeneous 3D Integration
Resource Library Archives - 3D InCites, Januar 2015

Vorträge

Peter Ramm
Our Early and Ongoing Work in 3D Integration
3D ASIP, Redwood City, USA, 15. - 17. Dezember 2015

Christoph Kutter
Printing processes and roll-to-roll assembly processes for extreme high volume sensor applications
Trillion Sensor Summit, Orlando, USA, 8. - 10. Dezember 2015

Christoph Kutter
Sensoren für das Internet der Dinge
Erfurter Technologiedialog, im Thüringer Landtag, 9. November 2015

Christof Landesberger
Embedding Die in Flexible Substrates
TechSearch Workshop „Panel Processing – Filling the Gap Between Frontend and PCB”,  hosted by Fraunhofer EMFT and TechSearch International, Inc., München, Deutschland, 9. November, 2015

Heinrich Wolf
In-Situ Measurements of Stress Currents During System Level ESD Tests
ESD-Forum, München, Deutschland, 5. - 6. November 2015

Tekfouy Lim
System Level Investigation of a Multi-Modal, Modular Artificial Skin
ESD-Forum, München, Deutschland, 5. - 6. November 2015

Dennis Helmut
Simulation and Characterization of Setups for CDM and CC-TLP
ESD-Forum, München, Deutschland, 5. - 6. November 2015

S. Kibler, M. Richter, C. Kutter
Grenzen der Dosiergenauigkeit eines geregelten Nanoliter pro Sekunde Mikrodosiersystems für Schmierstoffdosierung mit einem kapazitiven Time-of-Flight Flow Sensor
MikroSystemTechnik Kongress 2015, Karlsruhe, Deutschland, 26. - 28. Oktober 2015
ISBN 978-3-8007-4100-7, pp. 50-53

Nagarajan Palavesam, Detlef Bonfert, Waltraud Hell, Christof Landesberger, Horst Gieser, Christoph Kutter, Karlheinz Bock
Electrical Behaviour of Flip-Chip Bonded Thin Silicon Chip-on-Foil Assembly during Bending
2015 IEEE 21" international Symposium/or Design and Technology in Electronic Packaging (SIITME), Brasov, Romania, 22. -25. Oktober 2015

Robert Wieland
Innovative and environmental friendly Fluorine F2 based cleaning process to replace C2F6, CF4 and NF3 as cleaning gas
Semicon 2015, Dresden, Deutschland, 6. - 8. Oktober, 2015

Martin Richter
Cost efficient miniaturised silicon micropumps for medical applications
Semicon 2015, Dresden, Deutschland, 6. - 8. Oktober, 2015

Christof Landesberger
New processing scheme for embedding and interconnection of ultra-thin IC devices in flexible chip foil packages
Semicon 2015, Dresden, Deutschland, 6. - 8. Oktober 2015

Christoph Kutter
Sensors for the Internet of Things
11th BBMEC International Biosensors and Bioanalytical Microtechniques in Environmental, Food & Clinical Analysis Conference, Regensburg, Deutschland, 28. - 30. September 2015

Johan Bourgeat, Boris Heitz, Jean Jimenez, Philippe Galy, Tekfouy Lim
Self-ESD-Protected Transmission Line Broadband in CMOS28nm UTBB-FDSOI
The 37th International Technical Forum on Electrical Overstress and Electrostatic Discharge, Reno, USA, 27. September - 02. Oktober 2015 

Heinrich Wolf, Horst Gieser
Secondary Discharge - A Potential Risk During System Level HBM ESD Testing
The 37th International Technical Forum on Electrical Overstress and Electrostatic Discharge, Reno, USA, 27. September - 02. Oktober 2015 

Christian Götz
PEDOT/PSS as transparent electrode material for impedimetric whole-cell biosensors
Uni Regensburg (BBMEC), Regensburg, 27. September 2015

Andy Heinig, Muhammad Waqas Chaudhary, Peter Schneider, Josef Weber, Peter Ramm
Current and Future 3D Activities at Fraunhofer
3DIC 2015 / IEEE, Sendai, Japan, 31. August - 2. September 2015

Nagarajan Palavesam, Christof Landesberger, Christoph Kutter
Finite Element Analysis of uniaxial bending of ultra-thin Silicon dies embedded in flexible foil substrates
IEEE 11th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME) 2015, Glasgow, Großbritannien, 29. Juni - 2. Juli 2015

Peter Ramm, Wolfgang A. Vitale, Montserrat Fernández-Bolaños, Reinhard Merkel, Amin Enayati, Ilja Ocket, Walter De Raedt, Josef Weber, Adrian M. Ionescu   
Fine Pitch 3D-TSV Based High Frequency Components for RF MEMS Applications
ECTC 2015, San Diego, USA, 26. - 28. Mai 2015

Nagarajan Palavesam, Christof Landesberger, Karlheinz Bock
Integration of ultra-thin silicon chips in foil substrates and mechanical reliability analysis
EU Project CONTEST Summer School, Lille, Frankreich, 18. - 22. Mai 2015

Christoph Kutter
Sensors for the Internet of Things
Tsinghua-ROHM International Forum of Industry-Academia, Beijing, China, 8. Mai 2015

Robert Wieland
Wafer edge protection kit for MEMS and TSV Si-etching
SPIE Mictrotechnologies Smart Sensors, Actuators, and MEMS VII Conference, Barcelona, Spanien, 5. Mai 2015

Sabine Trupp
Sensormaterialien - von Nanosensoren bis zur Flächensensorik
Fachseminar Nanotechnologie bei der Papierherstellung, Papiertechnische Stiftung, München, Deutschland, 28.-29. April 2015

Christoph Kutter
Sensoren als die Key Enabler für das Internet der Dinge – die Trillion Sensor Initiative
AMA Wissenschaftsrat, Reutlingen, Deutschland, 25. März 2015

Peter Ramm, Armin Klumpp, Alan Mathewson, Kafil M. Razeeb, Reinhard Pufall
The European 3D Heterogeneous Integration Platform (e-BRAINS) – a Particular Focus on Reliability and Low-Temperature Processes for 3D Integrated Sensor Systems
IMAPS Device Packaging Conference, Scottsdale, USA, 17. - 19. März 2015