Publikationen in 2016

Veröffentlichungen

Adrian M. Ionescu, Montserrat Fernández-Bolaños, Wolfgang A. Vitale, Amin Enayati, Ilja Ocket, Walter De Raedt, Armin Klumpp, Reinhard Merkel, Josef Weber, Peter Ramm
3D TSV Based High Frequency Components for RF IC and RF MEMS Applications
IEEE 3DIC 2016, San Francisco, USA, 9. November 2016

J. Boudaden, A. Klumpp, I. Eisele, C. Kutter
Smart capacitive CO2 sensor
Proceedings IEEE sensors, USA, 2016 (775-777)

Bernadette Kinzel, Detlef Bonfert, Siegfried Röhl, Florian Lippert, Frank Vanselow, Erkan Isa, Doris Schmitt-Landsiedel, Linus Maurer
A novel Micropump Driver used in environmental sensor applications
IEEE Sensors Conference, Orlando, USA, 30. Oktober - 2. November 2016

Stephan Altmannshofer, Ignaz Eisele, Alexander Gschwandtner
Hydrogen microwave plasma treatment of Si and SiO2
Surface & Coatings Technology, 2016 Elsevier B.V., 14. Juli 2016

P. P. Bora, M. Roner, D. Borggreve, A. Hurni, E. Isa, L. Maurer
Development of a Digital Temperature Transducer ASIC in a 28 nm FD-SOI CMOS Process for a Spaceborne Low Power Sensor Bus
European Space Agency (ESA), Gothenburg, Schweden, 13. Juni 2016

Nagarajan Palavesam
Mechanical Reliability Analysis of Ultra-thin Chip-on-Foil Assemblies under different types of recurrent bending
IEEE ECTC 2016, Las Vegas, 31. Mai - 3. Juni 2016

R. Wieland, M. Pittroff, J. Boudaden, S. Altmannshofer and C. Kutter
Environmental-Friendly Fluorine Mixture for CVD Cleaning Processes to Replace C2F6, CF4 and NF3
ECS 2016, San Diego, CA, USA, 31. Mai 2016 

Christof Landesberger
Novel processing scheme for embedding and interconnection of ultra-thin IC devices in flexible chip foil packages and recurrent bending reliability analysis
ICEP 2016, Sapporo, Japan, 22. - 24. April 2016

Christof Landesberger, Nagarajan Palavesam, Andreas Drost, Waltraud Hell, Robert Faul, Christoph Kutter
Thin chip foil packaging: An enabling technology for ultra-thin packages
Chip Scale Review, März - April 2016

Pragoti Pran Bora, David Borggreve, Erkan Isa, Linus Maurer
Design of Analog-to-Digital-Converters in 28 nm Fully Depleted Silicon On Insulator CMOS Technology
Cadence, München, 29. Januar 2016

P. Ramm, A. Klumpp, J. Weber, P. Schneider, R. Pufall, M. Engelhardt
Our Early And Our Ongoing Work In 3D Integration
3D InCites Ressource Library, Phoenix & San Francisco, USA, Januar 2016

Vorträge

Peter Ramm
An Overview on Silicon Technologies, Devices and 3D Integration at Fraunhofer EMFT Munich
Fraunhofer Symposium, Sendai, Japan, 24. November 2016

Martin Richter
Micropumps and micro dosing systems for emerging medical applications
Compamed, Düsseldorf, 14.-17. November 2016 

Christof Landesberger
Hybrid Integration for Plastic Film Electronics
Semicon Europe, Grenoble, France, 25.-27. Oktober, 2016

Peter Ramm
Fraunhofer EMFT´s competence in Silicon Technology, Devices and 3D Integration
Invensas Workshop, San Jose, USA, 21. Oktober, 2016

Martin Richter
Miniaturization of Silicon Micropumps
MIDEM 2016, 52nd International Conference on Microelectronics, Devices and Materials, Ankaran, Slovenia, 28.-30. September, 2016

Martin Richter
Applications and technology of piezo driven micropumps
MME 2016 - 27th Micromechanics and Microsystems Europe Workshop, Cork, Irland, 28.-30. August 2016

Christian Götz
PEDOT/PSS as Transparent Electrode Material for Impedimetric Whole-cell Biosensors
IBCA, Universität Regensburg, 10. August 2016 

Martin Richter
Cost-efficient miniaturized silicon micropumps for medical applications
Crossing borders to benefit patients. Translational medicine - moving the results from the lab to the clinic, Zürich, Schweiz, 24. Juni 2016

Robert Wieland
Environmental Friendly Fluorine Mixture for CVD Cleaning Processes
ECS 2016, San Diego, USA, 31. Mai 2016

Bernadette Kinzel
An integrated dual-polarity high-voltage driver concept for micropump applications
Smart Systems Integration, München, 9. - 10. März 2016

Martin Heigl
CMOS Compatible Nanogap-Field-Effect-Transistor for Integrated NEMS Application
Smart Systems Integration, München, 9. - 10. März 2016

Nagarajan Palavesam
A novel test method for robustness assessment of very small, functional ultra-thin chips embedded in flexible foils
Smart Systems Integration, München, 9. - 10. März 2016

Lars Nebrich, Franz Wenninger, Thomas Ganka, Ignaz Eisele
Gamma-Detektor Modul mit Silizium-Photomultiplier Sensor und BLE-Kommunikation
5. Landshuter Symposium Mikrosystemtechnik, Landshut, 9. - 10. März 2016