Publikationen in 2019

Veröffentlichungen

T. Diederichs, G. Pugh, A. Dorey, Y. Xing, J.R. Burns, Q.H. Nguyen, M. Tornow, R. Tampé, S. Howorka
Synthetic protein-conductive membrane nanopores built with DNA
Nature Communications 10, 5018 2019

J. Weber, R. Fung, R. Wong, H. Wolf, H. A. Gieser, L. Maurer
Stress current slew rate sensitivity of an ultra-high-speed interface IC
IEEE Transactions on Device and Materials Reliability, Vol. 19, Issue: 4, November 2019

M. Zinkl, J. Wegener
Using animal cells as sensors for xenobiotics: monitoring phenotypic changes by multimodal impedance assays
Current Opinion in Environmental Science & Health, Elsevier B.V., Amsterdam, the Netherlands, 2019
DOI 10.1016/j.coesh.2019.08.007

G. Acri, L. Boccia, N. Corrao, F. Podevin, E. Pistono, T. Lim, E. N. Isa, P. Ferrari
Compact and performing transmission lines for mm-wave circuits design in advanced CMOS technology
In Proc. European Microwave Week 2019, 29. September - 4. Oktober 2019, Paris, France

P. Kumar, J. Al-Eryani, D. Borggreve, E. Böhme, P. P. Bora, E. N. Isa, L. Maurer
A 23 GHz VCO with 13% FTR in 22 nm FDSOI
S3S CONFERENCE 2019, 14. - 17. Oktober 2019, San Jose, California, USA

M. Ammer, S. Miropolskiy, A. Rupp, F. zur Nieden, M. Sauter, L. Maurer
Characterizing and Modelling Common Mode Inductors at high Current Levels for System ESD Simulations
41st Annual EOS/ESD Symposium (EOS/ESD), 2019

M. Ammer, A. Rupp, U. Glaser, Y. Cao, M. Sauter, L. Maurer
Application Example of a Novel Methodology to Generate IC Models for System ESD and Electrical Stress Simulation out of the Design Data
41st Annual EOS/ESD Symposium (EOS/ESD), 2019

P. Bora, D. Borggreve, F. Vanselow, E. Isa, L. Maurer
A low power Sigma-Delta Modulator in an advanced 22 nm FD SOI CMOS Process for sensor applications
13th International Conference and Exhibition on Integration Issues of Miniaturized Systems, Pages: 1 - 7, 2019

M. Ammer, Y. Cao, A. Rupp, M. Sauter, L. Maurer
Bringing the SEED Approach to the Next Level: Generating IC Models for System ESD and Electrical Stress Simulation out of Design Data
IEEE Transactions on Electromagnietic Compatibility, Pages: 1 - 11, 2019

S. Koch, B. Orr, H. Gossner, H. Gieser, L. Maurer
Identification of Soft Failure Mechanisms Triggered by ESD Stress on a Pawered USB 3.0 Interface
IEEE Transactions on Electromagnetic Compatibility, Pages: 20 - 28, 2019

J. Boudaden, A. Klumpp, H.-E. Endres, I. Eisele
Towards Low Cost and Low Temperature Capacitive CO2 Sensors Based on Amine Functionalized Silica Nanoparticles
Nanomaterials 2019, 9, 1097; 31. Juli 2019, Basel, Schweiz
DOI 10.3390/nano9081097

K.B. Saller, H. Riedl, P. Lugli, G. Koblmüller, M. Tornow
One-step transfer printing of patterned nanogap electrodes
Journal of Vacuum Science and Technology B 37, 040602, 2019

S. Pfaehler, A. Angi, D. Chryssikos, A. Cattani-Scholz, B. Rieger, M. Tornow
Space charge-limited current transport in thin films of alkyl-functionalized silicon nanocrystals
Nanotechnology 30, 395201, 2019

P. P. Bora, D. Borggreve, F. Vanselow, E. Isa, L. Maurer
A 0.8 V Low-Power 3rd order Sigma-Delta Modulator in 22 nm FDSOI CMOS Process for Sensor Interfaces
In Proc. 17th IEEE NEWCAS Conference, 23. - 26. Juni 2019, Munich, Germany

N. Palavesam, W. Hell, A. Drost, C. Landesberger, C. Kutter, K. Bock
A novel low cost roll-to-roll manufacturing compatible ultra-thin chip integration and direct metal interconnection process for flexible hybrid electronics
NordPac 2019, The Nordic Conference on Microelectronics Packaging, 11. - 13. Juni 2019, Lyngby, Denmark
DOI 10.23919/NORDPAC.2019.8760350

G. Acri , F. Podevin, E. Pistono, L. Boccia , N. Corrao, T. Lim, E. N. Isa, and P. Ferrari
A Millimeter-Wave Miniature Branch-Line Coupler in 22-nm CMOS Technology
IEEE Solid-State Circuits Letters, Vol. 2, no. 6, June 2019
DOI 10.1109/LSSC.2019.2930197

M. Speckbacher, M. Rinderle, W. Kaiser, E.A. Osman, D. Chryssikos, A. Cattani-Scholz, J.M. Gibbs, A. Gagliardi, M. Tornow
Directed Assembly of Nanoparticle Threshold-Selector Arrays
Advanced Electronic Materials 5, 1900098, 2019

J. A. Stolwijk, M. Skiba, C. Kade, G. Bernhardt, A. Buschauer, H. Hübner, P. Gmeiner and J. Wegener
Increasing the throughput of label-free cell assays to study the activation of G-protein-coupled receptors
Integrative Biology, Volume 11, Pages 99 - 108, Oxford University Press, Oxford, UK, 2019 
DOI 10.1093/intbio/zyz010

Joachim Wegener
Measuring the Permeability of Endothelial Cell Monolayers: Teaching New Tricks to an Old Dog
Biophysical Journal, Elsevier B.V., Amsterdam, the Netherlands, 23. April 2019
DOI 10.1016/j.bpj.2019.03.018

S. Michaelis, J. Wegener
Zellen als Sensoren, Effekt- statt Konzentrationsanalytik
Biologische Transformation, Springer Vieweg, Berlin, Heidelberg, Deutschland, 2019
DOI 10.1007/978-3-662-58243-5_7

P. Kumar, J. Al-Eryani, B. Taş Ulaşlı, E. Böhme, F. Vanselow, E. N. Isa, L. Maurer
A 400 mV, wide band-VCO with the central Frequency of 10.5 GHz and FTR of 2.4 GHz, designed in 22nm FDSOI CMOS
In Proc. EUROSOI – ULIS 2019 Conference, 1. - 3. April 2019, Grenoble, France

Paul D. Franzon, Erik Jan Marinissen, Muhannad S. Bakir, Philip Garrou, Mitsumasa Koyanagi, Peter Ramm
Handbook of 3D Integration: Vol. 4: Design, Test and Thermal Management of 3D Integrated Circuits
ISBN 978-3-527-33855-9, Wiley, Weinheim, New York, March 2019    

J.D. Bartl, P. Scarbolo, D. Brandalise, M. Stutzmann, M Tornow, L. Selmi, A. Cattani-Scholz
Role of Different Receptor-Surface Binding Modes in the Morphological and Electrochemical Properties of Peptide-Nucleic-Acid-Based Sensing Platforms
Langmuir 35, 3272, 2019

Helen Hoffmeister, Andreas Fuchs, Laura Strobl, Frank Sprenger, Regina Gröbner-Ferreira, Stefanie Michaelis, Petra Hoffmann, Julian Nazet, Rainer Merkl, Gernot Längst
Elucidation of the functional role of the Q- and I-motif in the human chromatin remodeling enzyme BRG1
Journal of Biological Chemistry, The American Society for Biochemistry and Molecular Biology, Inc., Rockville, Maryland, USA, 15. Januar 2019
DOI 10.1074/jbc.RA118.005685

Carina Schmittlein, Robert Johannes Meier, Lisa Sauer, Gregor Liebsch, Joachim Wegener
Image-Based Monitoring of Oxygenation in Microfluidic Cell Culture
Genetic Engineering & Biotechnology News, Mary Ann Liebert, Inc., New Rochelle, New York, USA, Januar 2019
DOI 10.1089/gen.39.01.18

Simone Ruckdäschel, Christian Kade, Joachim Wegener
Quartz Crystal Microbalance: Basics and Applications in Biology
eLS, Cell Biology, John Wiley & Sons, Ltd., Chichester, UK, 2019
DOI 10.1002/9780470015902.a0028178

Bscheid, C.; Engst, C.R.; Eisele, I.; Kutter, C. 
Minority Carrier Lifetime Measurements for Contactless Oxidation Process Characterization and Furnace Profiling
Materials 2019, 12, 190

Vorträge

C. Durasiewicz, T. Thalhofer
Hochdynamische Druckpulsanalyse einer Mikromembranpumpe mittels in-line MEMS-Sensor
MikroSystemTechnik Kongress 2019, 28. - 30. Oktober 2019, Berlin, Deutschland

P. Ramm, A. Klumpp, C. Landesberger, J. Weber, A. Heinig, P. Schneider, G. Elst, M. Engelhardt
Fraunhofer´s Initial and Ongoing Contributions in 3D IC Integration
Invited Talk, IEEE 3DIC, 8. - 10. Oktober 2019, Sendai, Japan

J. Weber
Technologies for 3D Heterogeneous System Integration
Sinano Workshop “Heterogeneous Integration of Nanomaterials and Innovative Devices”, ESSDERC/ESSCIRC 2019, 23. September 2019, Krakau, Polen

R. Schönmann
Simulation of time-dependent molecular transport in vacuum systems
Third European Contamination Modelling Workshop, 10. - 11. September 2019, Friedrichshafen, Deutschland

J. Boudaden, A. Klumpp
A Novel Photoelectrochemical Biosensor to detect Catechol
Sensor+Test 2019, 25  - 27. Juni 2019, Nürnberg, Deutschland

M. Steinmaßl, J. Boudaden, H.-E. Endres, D. Reiser, M. Heigl, K. Neumeier, I. Eisele, C. Kutter
Mikroanalysesystem auf Basis eines ladungsempfindlichen Fluidsensors mit Rückseitenkontakten
20. GMA/ITG Fachtagung, Sensoren und Messsysteme 2019, 25. und 26. Juni 2019, Nürnberg, Deutschland

L.  Govoni, T. Perekhodko, Piyush.k, L. Maurer, D. Schupke, T. Meyerhoff, E. Böhme, M. Kreissig, F. Protze, S. Damjancevic
REFERENCE (ECSEL JU) Project, Aeronautic WAIC hotspot: wireless video transmission using an SOI RF front-end
In Proc. 17th IEEE NEWCAS Conference, 23. - 26. Juni 2019, Munich, Germany

S. Scherbaum, C. Landesberger, B. Auer, H. Klingler, B. Brandstätter, E. Brandl, J. Bravin
Toward improved FOWLP manufacturing by using self-alignment process
Smart Systems Integration, 10. - 11. April 2019, Barcelona, Spain

E. Yacoub-George, N. Palavesam, W. Hell, M. König, R. Faul, C. Landesberger, C. Kutter
Ultra-thin flexible interposer – a flexible hybrid integration approach to replace wire bonds
Smart Systems Integration, 10. - 11. April 2019, Barcelona, Spain

J. Häfner, C. Durasiewicz, T. Thalhofer, S. Kibler, C. Kutter
Smart Sensor System for Constant Dosing with Micro Diaphragm Pumps
Smart Systems Integration, 10. - 11. April 2019, Barcelona, Spain

A. Bußmann, L. Grünerbel
Increasing piezo micro diaphragm pump performance by optimizing piezo actuation
Smart Systems Integration, 10. - 11. April 2019, Barcelona, Spain

L. Nebrich
Sensors & Aktuators
BITCOM IoT – Auf der Suche nach Mehrwerten zwischen Milliarden von Sensoren, Technologie, Security und Business Cases im Internet der Dinge werden ausgetestet – ist die Umsetzung einer großen Vision nur noch Routine?, Experten-Roundtable, 30. Januar 2019, Köln, Deutschland