Publikationen in 2020

Veröffentlichungen

Peter Ramm, Paul Franzon, Phil Garrou, Raja Swaminathan, Pascal Vivet, Mustafa Badaroglu 
Heterogeneous integration and chiplet assembly – all between 2D and 3D
IEEE EPS Newsletter, New York, USA, 2020

D. Reiser, A. Drost, D. Chryssikos, I. Eisele, M. Tornow
Temperature driven memristive switching in Al/TiO2/Al devices
IEEE 20th International Conference on Nanotechnology (IEEE-NANO), July 29-31 2020, Virtual Conference

Sakolski, Oleg; Kumar Poongodan, Prajith; Vanselow, Frank; Maurer, Linus
A Feedforward Compensated High-Voltage Linear Regulator With Fast Response, High-Current Sinking Capability
IEEE Solid-State Circuits Letters, Volume 3, pages 114-117, IEEE, New York, USA, 2020 
https://doi.org/10.1109/LSSC.2020.3005787

Lei Zhang, David Borggreve, Frank Vanselow, Ralf Brederlow
Quantization Considerations of Dense Layers of Convolutional Neural Networks for Resistive Crossbar Implementation
IEEE International Conference on Modern Circuits and Systems Technologies (MOCAST) on Electronics and Communications, Bremen, Germany, 11 - 13 May 2020 

Peter Ramm, Armin Klumpp, Christof Landesberger, Josef Weber, Andy Heinig, Peter Schneider, Guenter Elst, Manfred Engelhardt
Fraunhofer´s Initial and Ongoing Contributions in 3D IC Integration
IEEE Xplore, 09 April 2020

C. R. Engst, I. Eisele, C. Kutter
Defect characterization of unannealed neutron transmutation doped silicon by means of deep temperature microwave detected photo induced current transient spectroscopy
Journal of Applied Physics, Vol. 127, No. 3, S. 035704, Jan. 2020.
https://doi.org/10.1063/1.5134663

Enno Böhme
REFERENCE: A 4.3-GHz fractional-N PLL frequency synthesizer in GLOBALFOUNDRIES 22FDX
EUROPRACTICE Activity Report 2019-2020, Leuven, Belgium, page 22

N. Palavesam, W. Hell, A. Drost, C. Landesberger, C. Kutter, K. Bock
Influence of Flexibility of the Interconnects on the Dynamic Bending Reliability of Flexible Hybrid Electronics 
Electronics 2020, 9(2), 238
DOI 10.3390/electronics9020238

Vorträge

J. Weber
High-density W-filled TSVs for advanced 3D-Integration
Invited Talk, Nanoinnovation 2020, September 13-18, 2020

P. Ramm, P. Vivet, T. Braun, M. Engelhardt, A. Klumpp, J. Weber
3DIC: Past, Present and Future – a European Perspective
Plenary Talk, ECTC 2020, June 2020