Automotive Packaging Reliability Requirements: Challenges and Opportunities

November 11, 2019 at Fraunhofer EMFT in Munich, Germany

joint workshop organized by TechSearch International, Inc. and Fraunhofer EMFT


The purpose of the workshop is to provide a forum for experts to discuss challenges related to meeting automotive reliability requirements, including package and board-level reliability.  Understanding these challenges is critical to advancing the packaging and assembly technology in automotive electronics. In order to promote free discussion, no press members will be in attendance. 


The advance registration fee of €490 or US $550 includes attendance at the technical sessions, lunch, snack breaks, and a networking reception following the workshop.  Registration at the door is €600 (US $680). 

Seating is limited, so if you plan to attend please register now by emailing the attached registration form to or fax to TechSearch International (1-512-372-8889). Advance payment by American Express, Visa, Master Card, or check on a U.S. bank is accepted. 

Please contact us if we can be of assistance.