GET STARTED WITH FLEXIBLE HYBRID ELECTRONICS
15 OCT 2019 MUNICH, GERMANY
The combination of state-of-the-art semiconductor devices and upcoming manufacturing technologies for cost effective processing of flexible film substrates has paved the way to a large variety of new applications in the emerging Flexible Hybrid Electronics (FHE).
Integration of sensors, Integrated Circuits (IC), displays, antennas and communication devices on film substrates enable extremely thin and bendable form factors where existing board level technologies fall short. Key enabling technologies are fabrication of high-performance wiring patterns, integration of ultra-thin bare dies/components and ongoing advancements in roll-to-roll processing of film substrates.