Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT
Sensor materials for combined in-line measurements
Applications
Application examples from the fields of competence
Innovative Sensor Solutions
- Assistance system to detect black ice
- A plaster that gets 'under your skin'
- Biosensors detect plant viruses
- Condition monitoring of high-end production equipment
- Development and characterization of high-performance gas sensors
- Environmental analytics for all – co-creation with the maker scene
- Fabric kit with integrated Sensor system
- High-performance modules for the Internet of Things
- Intelligent food packaging
- Microwave spectroscopic analysis of liquids
- Mobile detector for more than 60 environmentally harmful gases
- MRSA rapid test: multi-resistant staphylococcus aureus
- New sensor concept for FET transistors
- OptoMigration – an automated, high-precision wound healing assay in vitro
- Point of Care System to detect MRGN Bacteria
- Securely networked sensors in the healthcare sector
- Sensor nodes and their networking for digital production
Micro Dosing
Flow sensors
- Artificial sphincter system with microfluid actuators
- Autonomous implant for cancer treatment
- Industrialization of stainless steel micropumps for medical technology
- Miniaturized degassers for mobile applications
- Smart catheter for cell-based heart attack therapy
- The fourth dimension: fragrances are introduced to virtual reality
Safe and Secure Electronics
ESD System test with wide band measurement of the secondary discharge current
- Accelerated model for mechanically caused material damage
- Characterization of ESD protection structures
- Correlation study between ESD test models
- Detecting degradation processes early on
- ESD characterization of remote keys
- Failsafe electronics for autonomous driving
- Innovative exposure method for improved ESD protection
- Reliable detection of hardware trojans
Manufacturing-oriented Microtechnologies
Detailed view processing of foil system to measure temperature
- 3D integration technologies for IoT applications
- Better chips for groundbreaking communication infrastructures
- Compact and energy-efficient power semiconductors
- Electrical connection technology as an intelligent diagnostic interface
- Electronic modules for future mobile phone generations
- Electrostatic carrier foils for thin wafers
- Energy for smart objects
- Environment-friendly cleaning gas for the semiconductor industry
- Extremely low-noise JFETS for the gigahertz range
- High-performance modules for the Internet of Things
- Integrated high-voltage driver for micropumps
- System integration technologies for multifunctional, foil-based electronic systems