Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT
Sensor materials for combined in-line measurements
Applications
Smallest silicon micromembrane pump in the world with dimensions of 3.5 x 3.5 x 0.6 mm3
Quartz resonator to analyze cytomechanics
Portable control electronic for straightforward micro pump driving
Ultrathin flexible interposer
Micropump Driver IC in QFN48 Package soldered on a PCB
Tamper-protection foil wrapped around an electronic housing
Split-Ring-Resonators for metamaterial construction
Smart wireless PCB-connector for enabling continuous measurement of temperature and current of individual contacts to acquire predictive maintenance data
RF and mm-wave Voltage Controlled Oscillators and transmission lines on a 3 x 3 mm2 integrated circuit on the 22-FDSOI CMOS technology from GLOBALFOUNDRIES
System for the detection of MRSA bacteria
Multifunctional communication board (NFC, USB, BLE) for reading digitally networked sensor nodes (Cooperation Würth Elektronik eiSos/Fraunhofer EMFT)
Application examples from the fields of competence
Innovative Sensor Solutions
- Biosensors detect plant viruses
- Condition monitoring of high-end production equipment
- Development and characterization of high-performance gas sensors
- Environmental analytics for all – co-creation with the maker scene
- High-performance modules for the Internet of Things
- Microwave spectroscopic analysis of liquids
- Mobile detector for more than 60 environmentally harmful gases
- MRSA rapid test: multi-resistant staphylococcus aureus
- New sensor concept for FET transistors
- Point of Care System zum Nachweis von MRGN-Bakterien
- Securely networked sensors in the healthcare sector
- Sensor nodes and their networking for digital production
Safe and Secure Electronics
ESD System test with wide band measurement of the secondary discharge current
Manufacturing-oriented Microtechnologies
Detailed view processing of foil system to measure temperature
- 3D integration technologies for IoT applications
- Better chips for groundbreaking communication infrastructures
- Compact and energy-efficient power semiconductors
- Electrical connection technology as an intelligent diagnostic interface
- Electronic modules for future mobile phone generations
- Electrostatic carrier foils for thin wafers
- Energy for smart objects
- Environment-friendly cleaning gas for the semiconductor industry
- Extremely low-noise JFETS for the gigahertz range
- High-performance modules for the Internet of Things
- Integrated high-voltage driver for micropumps
- System integration technologies for multifunctional, foil-based electronic systems