IIn the REFERENCE joint project, 16 European partners worked together to enhance the use of novel radio-frequency silicon-on-insulator (RF-SOI and FD-SOI) technologies in the development of RF front-end modules (FEMs) for communication systems. Both techniques provide great potential in terms of performance, cost and integration requirements of the industry for electronic modules for wireless communication systems. The target was to enable new applications in the mobile communications, Internet of Things, automotive and aerospace sectors. The project was successfully finished at the end of 2019
Over the past four years, the REFERENCE project focused on developing innovative tools to address the at that time unresolved requirements for high data rate 4G+ communications and pave the way for next generation 5G communications through substrate development and design optimization. The work packages included materials, technical substrates, processes, design, metrology and system integration.