Better chips for groundbreaking communication infrastructures

Description

© Fraunhofer EMFT

Fraunhofer EMFT scientist working on the design and simulation of an analog-digital converter

The aim of the EU project WAYTOGOFAST (Which Architecture Yields Two Other Generations Of Fully Depleted Advanced Substrates and Technologies) is to develop improved chips based on FDSOI technology (Fully Depleted Silicon On Insulator), thereby laying the foundation for establishing an energy-efficient, future-oriented communication infrastructure. Here, the semiconductor manufacturer STMicroelectronics coordinates the research and development activities of the 33 project partners from research and industry.

Fraunhofer EMFT contributes its expertise in the simulation, design and measurement of analog, mixed-signal and millimeter wave circuits: the research team is developing innovative RF/mm wave circuity in the 77 GHz range using novel 14-nm FDSOI CMOS technology. This permits the design of highly integrated, energy-saving circuits. The aim is to use the results to confirm the required performance capacity for RF applications as well as for automotive radar and terahertz telecommunications. Fraunhofer EMFT is working with Sony Deutschland GmbH on the development of a millimeter wave system-in-package technology (SiP). This offers a number of benefits such as lower losses in the high-frequency range, cost-efficient manufacture at silicon wafer level, high integration capacity (of both the passive and the active components) and improved heat dissipation.

Partners

  • STMICROELECTRONICS GRENOBLE 2 SAS
  • STMICROELECTRONICS S.A.
  • COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
  • S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES SA
  • CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE
  • SILTRONIC AG
  • GLOBALFOUNDRIES Dresden Module One LLC & Co. KG
  • DAINIPPON SCREEN DEUTSCHLAND GMBH
  • LAM RESEARCH AG
  • KLA-TENCOR CORPORATION (ISRAEL)
  • FEI ELECTRON OPTICS BV
  • UNIVERSITE CATHOLIQUE DE LOUVAIN
  • HSEB DRESDEN GMBH
  • BRUKER AXS GMBH
  • PICOSUN OY
  • SOCIONEXT EUROPE GMBH
  • PRODRIVE BV
  • APPLIED MATERIALS FRANCE
  • EV GROUP E. THALLNER GMBH
  • NOVA MEASURING INSTRUMENTS LTD
  • ALCATEL-LUCENT DEUTSCHLAND AG
  • FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG EV
  • SONY DEUTSCHLAND GMBH
  • INSTITUT POLYTECHNIQUE DE GRENOBLE
  • UNIVERSIDAD DE GRANADA
  • MUNEDA GmbH
  • HQ-Dielectrics GmbH
  • Gold Standard Simulations ltd
  • GLOBAL TCAD SOLUTIONS GMBH
  • LAM RESEARCH SAS
  • TOKYO ELECTRON EUROPE LIMITED
  • INTEGRATED SYSTEMS DEVELOPMENT S.A.
  • Funding

    The project is being funded as part of the EU program Electronic Components and Systems for European Leadership Joint Undertaking (ECSEL JU, Project ID: 662175).