The aim of the EU project WAYTOGOFAST (Which Architecture Yields Two Other Generations Of Fully Depleted Advanced Substrates and Technologies) is to develop improved chips based on FDSOI technology (Fully Depleted Silicon On Insulator), thereby laying the foundation for establishing an energy-efficient, future-oriented communication infrastructure. Here, the semiconductor manufacturer STMicroelectronics coordinates the research and development activities of the 33 project partners from research and industry.
Fraunhofer EMFT contributes its expertise in the simulation, design and measurement of analog, mixed-signal and millimeter wave circuits: the research team is developing innovative RF/mm wave circuity in the 77 GHz range using novel 14-nm FDSOI CMOS technology. This permits the design of highly integrated, energy-saving circuits. The aim is to use the results to confirm the required performance capacity for RF applications as well as for automotive radar and terahertz telecommunications. Fraunhofer EMFT is working with Sony Deutschland GmbH on the development of a millimeter wave system-in-package technology (SiP). This offers a number of benefits such as lower losses in the high-frequency range, cost-efficient manufacture at silicon wafer level, high integration capacity (of both the passive and the active components) and improved heat dissipation.