In the LEO project (platform technology for the resource-saving production of conductor paths on large surfaces equipped with electronics), Fraunhofer ISE and Fraunhofer EMFT are combining their expertise in fine line metallization and reel-to-reel processing as well as thin-chip integration in foils. The new process will allow the production of very large-area conducting path patterns and simplify the integration of electronic components. The process, which is based on the selective structuring of a thin aluminium/copper/polymer layer sequence by means of printing or laser processes and the subsequent electroplated copper deposition, offers the perspective of making even classical processes of printed circuit board production more cost-effective and at the same time more environmentally friendly and resource-saving. Based on an initial PCB design, the newly developed process sequence has made it possible to produce thin, galvanically reinforced conductiong paths on 50 µm thick foil substrates. In coordination with the advisory board consisting of leading representatives of the electronics and electroplating industry, the process sequence is to be stabilized and converted into a cost-effective reel-to-reel process. Furthermore, it is to be demonstrated that the process is suitable for the production of ultra-thin chip packages that do not require conventional wire bonds.