The aim of the joint European project REFERENCE under the coordination of SOITEC is to cluster Europe-wide expertise in the area of microelectronics and initiate collaboration along the transnational value creation chain. Innovative production techniques are to be developed for new high-frequency (HF) technologies to be used in the electronic modules of future mobile phone generations such as 4G+ and 5G. For this purpose, the project partners aim to create HF substrates in the form of 200 mm and 300 mm wafers for the first time. Expansion of the improved HF substrates (200 mm and 300 mm) would allow HF modules with higher integration densities and bandwidths in future, thereby enabling higher data throughput rates at lower production costs.
The partners are seeking to pave the way for the internationally competitive mass production of complete HF modules of the next generation in Europe: the aim is to demonstrate the success of this new technology using HF modules for the new avionics bandwidth (4.24.4 GHz) as an example. This will enable wireless communication in aircraft in the future. Fraunhofer EMFT’s focus here is developing the integrated circuits for the frequency synthesis, with the aim of`creating circuits with optimized high-frequency properties due to the improved substrates.