Integrated high-voltage driver for micropumps

Description

© Fraunhofer EMFT

Micropump driver ICs realized with 0.35 µm high voltage process

A Fraunhofer EMFT research team is working with 19 European partners from industry and research on the EU project ADMONT to develop an integrated high-voltage driver (ASIC) for micropumps. A pilot line of the chip is to be realized in the cleanrooms of X-Fab in Dresden.

The energy efficiency and response time of ASICs are significantly higher than is the case with the discrete type normally used nowadays. This enables pump accuracy to be increased and the electronics to be miniaturized without losing out on performance capacity – a key requirement for promising applications such as in medical implants or smartphones. The long-term project goal is to achieve an overall solution for microdosing systems which allows monitoring and control of the pump. The chip will monitor whether the pump is operating error-free, for instance, or adapt the pump function by means of various selectable program modes.

Partners

 

 

 

  • Heimann Sensor GmbH, Dresden (Germany)
  • X-FAB Dresden GmbH & Co. KG (Coordinator), Dresden (Germany)
  • Okmetic Oyj, Vantaa (Finland)
  • Systema GmbH, Dresden (Germany)
  • R&R-Ortner GmbH, Dresden (Germany)
  • Smartrac GmbH, Dresden (Germany)
  • SenseAir AB, Delsbo (Sweden)
  • Silicon Biosystems S.p.A., Bologna (Italy)
  • MAZeT GmbH, Jena (Germany)
  • EDC Electronic Design Chemnitz GmbH, Chemnitz (Germany)
  • Technikon Forschungs- und Planungsgesellschaft mbH, Villach (Austria)
  • Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., Munich (Germany)
  • Fraunhofer Institute for Photonic Microsystems, Dresden (Germany)
  • Fraunhofer-Institut für Elektronenstrahl- und Plasmatechnik & COMEDD, Dresden (Germany)
  • Fraunhofer Institute for Reliability and Microintegration - All Silicon System Integration Dresden, Dresden (Germany)
  • Fraunhofer Institute for Integrated Circuits IIS, Design Automation Division, Dresden (Germany)
  • Fraunhofer Research Institution for Modular Solid State Technologies, Munich (Germany)
  • Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH, Ilmenau (Germany)
  • KPS Diagnostics, Budapest (Hungary)
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    Funding

    The project is being funded under the ECSEL initiative (Electronic Components and Systems for European Leadership), the central funding instrument for microelectronics and nanoelectronics in the European Framework Programme for Research and Innovation HORIZON 2020 (project reference: 661796).