The Forum be-flexible will be held in cooperation with 2017 FLEX Europe forum this year, on November 15 and 16 in Munich, Germany.
This 2 day session, an integral part of SEMICON Europa 2017, co-located with productronica, Europe’s largest semiconductor manufacturing event, will address materials, manufacturing, new technologies and applications for flexible hybrid electronics (FHE) and printed electronics (PE) and will demonstrate the strong history of Europe in these fields. The joint conference offers a great opportunity to establish a new European platform for flexible electronics, manufacturing technologies and application scenarios.
In cooperation with the Fraunhofer EMFT’s Forum be-flexible, the FLEX Europe forum takes advantage of the intersection of PE and thin silicon (Si) devices. Key technical topics are expected to be covered, such as Thin Silicon, Flexible Sensors, Heterointegration on Flex, Bendable Electronics, Reliability of flexible electronics, Robotics.
The Call for Paperss has been launched recently by SEMI Europe. We like to encourage you to send your paper abstracts until 12 May 2017 to the organizational board of SEMI Europe