Printed Publications
Adrian M. Ionescu, Montserrat Fernández-Bolaños, Wolfgang A. Vitale, Amin Enayati, Ilja Ocket, Walter De Raedt, Armin Klumpp, Reinhard Merkel, Josef Weber, Peter Ramm
3D TSV Based High Frequency Components for RF IC and RF MEMS Applications
IEEE 3DIC 2016, San Francisco, USA, November 9, 2016
J. Boudaden, A. Klumpp, I. Eisele, C. Kutter
Smart capacitive CO2 sensor
Proceedings IEEE sensors, USA, 2016 (775-777)
Bernadette Kinzel, Detlef Bonfert, Siegfried Röhl, Florian Lippert, Frank Vanselow, Erkan Isa, Doris Schmitt-Landsiedel, Linus Maurer
A novel Micropump Driver used in environmental sensor applications
IEEE Sensors Conference, Orlando, USA, October 30 - November 2, 2016
Stephan Altmannshofer, Ignaz Eisele, Alexander Gschwandtner
Hydrogen microwave plasma treatment of Si and SiO2
Surface & Coatings Technology, 2016 Elsevier B.V., July 14, 2016
P. P. Bora, M. Roner, D. Borggreve, A. Hurni, E. Isa, L. Maurer
Development of a Digital Temperature Transducer ASIC in a 28 nm FD-SOI CMOS Process for a Spaceborne Low Power Sensor Bus
European Space Agency (ESA), Gothenburg, Schweden, June 13, 2016
Nagarajan Palavesam
Mechanical Reliability Analysis of Ultra-thin Chip-on-Foil Assemblies under different types of recurrent bending
IEEE ECTC 2016, Las Vegas, May 31 - June 3, 2016
R. Wieland, M. Pittroff, J. Boudaden, S. Altmannshofer and C. Kutter
Environmental-Friendly Fluorine Mixture for CVD Cleaning Processes to Replace C2F6, CF4 and NF3
ECS 2016, San Diego, CA, USA, May 31, 2016
Christof Landesberger
Novel processing scheme for embedding and interconnection of ultra-thin IC devices in flexible chip foil packages and recurrent bending reliability analysis
ICEP 2016, Sapporo, Japan, April 22 - 24, 2016
Christof Landesberger, Nagarajan Palavesam, Andreas Drost, Waltraud Hell, Robert Faul, Christoph Kutter
Thin chip foil packaging: An enabling technology for ultra-thin packages
Chip Scale Review March - April 2016
Pragoti Pran Bora, David Borggreve, Erkan Isa, Linus Maurer
Design of Analog-to-Digital-Converters in 28 nm Fully Depleted Silicon On Insulator CMOS Technology
Cadence, München, January 29, 2016
P. Ramm, A. Klumpp, J. Weber, P. Schneider, R. Pufall, M. Engelhardt
Our Early And Our Ongoing Work In 3D Integration
3D InCites Ressource Library, Phoenix & San Francisco, USA, January 2016