Publications in 2020

Printed Publications

Kai B. Saller, Kung-Ching Liao, Hubert Riedl, Paolo Lugli, Gregor Koblmüller, Jeffrey Schwartz, Marc Tornow
Contact Architecture Controls Conductance in Monolayer Devices
ACS Appl. Mater. Interfaces 12, 28446 (2020)

Martin, Devin; Sullivan, Scott; Bose, Indranil; Landesberger, Christof; Wieland, Robert 
Dicing of MEMS devices 
Tilli, M.: Handbook of silicon based MEMS materials and technologies : A volume in Micro and Nano Technologies, 3rd Edition. Amsterdam: Elsevier, 2020.  ISBN: 978-0-12-817786-0. S.677-689

Johannes D. Bartl, Stefano Gremmo, Martin Stutzmann, Marc Tornow, Anna Cattani-Scholz
Modification of silicon nitride with oligo(ethylene glycol)-terminated organophosphonate monolayers
Surface Science 697, 121599 (2020)

Maximilian Speckbacher, Matthias Jakob, Markus Döblinger, Jonathan G. C. Veinot, Aras Kartouzian, Ueli Heiz, Marc Tornow
Nonvolatile Memristive Switching in Self-assembled Nanoparticle Dimers
ACS Appl. Electron. Mater. 2, 1099 (2020)

Piyush Kumar, Dario Stajic, Enno Böhme, Erkan Nevzat Isa, Linus Maurer
A 500 mV, 4.5 mW, 16 GHz VCO with 33.3% FTR, designed for 5G applications
2020 IEEE Nordic Circuits and Systems Conference (NorCAS), October 27-28, 2020, Virtual Conference

L. Zhang, D. Borggreve, F. Vanselow and R. Brederlow
Quantization Considerations of Dense Layers in Convolutional Neural Networks for resistive Crossbar Implementation
2020 9th International Conference on Modern Circuits and Systems Technologies (MOCAST), Bremen, Germany, Sep 2020

P. K. Poongodan, F. Vanselow and L. Maurer
A Two-Level, High Voltage Driver Circuit with Nanosecond Delay for Ultrasonic Transducers
2020 9th International Conference on Modern Circuits and Systems Technologies (MOCAST), Bremen, Germany, Sep 2020

Peter Ramm, Paul Franzon, Phil Garrou, Raja Swaminathan, Pascal Vivet, Mustafa Badaroglu 
Heterogeneous integration and chiplet assembly – all between 2D and 3D
IEEE EPS Newsletter, New York, USA, 2020

Dlugosch, J.M., Devendra, D., Chryssikos, D., Artmeier, S., Speckbacher, M., Kamiyama, T., Tornow, M.
Metallic top contacts to self-assembled monolayers of aliphatic phosphonic acids on titanium nitride
Proceedings of the IEEE Conference on Nanotechnology, Volume 2020-July, July 2020, Article number 9183521, Pages 29-34

D. Reiser, A. Drost, D. Chryssikos, I. Eisele, M. Tornow
Temperature driven memristive switching in Al/TiO2/Al devices
IEEE 20th International Conference on Nanotechnology (IEEE-NANO), July 29-31 2020, Virtual Conference

Sakolski, Oleg; Kumar Poongodan, Prajith; Vanselow, Frank; Maurer, Linus
A Feedforward Compensated High-Voltage Linear Regulator With Fast Response, High-Current Sinking Capability
IEEE Solid-State Circuits Letters, Volume 3, pages 114-117, IEEE, New York, USA, 2020

Lei Zhang, David Borggreve, Frank Vanselow, Ralf Brederlow
Quantization Considerations of Dense Layers of Convolutional Neural Networks for Resistive Crossbar Implementation
IEEE International Conference on Modern Circuits and Systems Technologies (MOCAST) on Electronics and Communications, Bremen, Germany, 11 - 13 May 2020 

Peter Ramm, Armin Klumpp, Christof Landesberger, Josef Weber, Andy Heinig, Peter Schneider, Guenter Elst, Manfred Engelhardt
Fraunhofer´s Initial and Ongoing Contributions in 3D IC Integration
IEEE Xplore, 09 April 2020

Bernhard Lippmann, Niklas Unverricht, Aayush Singla, Matthias Ludwig, Michael Werner, Peter Egger, Anja Duebotzky, Helmut Graeb, Horst Gieser, Martin Rasche, Oliver Kellermann
Verification of physical designs using an integrated reverse engineering flow for nanoscale technologies
Elsevier Integration Volume 71, March 2020, Pages 11- 29 

C. R. Engst, I. Eisele, C. Kutter
Defect characterization of unannealed neutron transmutation doped silicon by means of deep temperature microwave detected photo induced current transient spectroscopy
Journal of Applied Physics, Vol. 127, No. 3, S. 035704, Jan. 2020.

Enno Böhme
REFERENCE: A 4.3-GHz fractional-N PLL frequency synthesizer in GLOBALFOUNDRIES 22FDX
EUROPRACTICE Activity Report 2019-2020, Leuven, Belgium, page 22

N. Palavesam, W. Hell, A. Drost, C. Landesberger, C. Kutter, K. Bock
Influence of Flexibility of the Interconnects on the Dynamic Bending Reliability of Flexible Hybrid Electronics 
Electronics 2020, 9(2), 238

Talks and Presentations

J. Weber
High-density W-filled TSVs for advanced 3D-Integration
Invited Talk, Nanoinnovation 2020, 13.-18. September 2020

P. Ramm, P. Vivet, T. Braun, M. Engelhardt, A. Klumpp, J. Weber:
3DIC: Past, Present and Future – a European Perspective
Plenary Talk, ECTC 2020, June 2020