EnSO - Energy for Smart Objects

Outline

© Photo Fraunhofer EMFT

Ultra thin chip-foil-package in QFN-format

Projections expect up to 24 Billion connected devices worldwide by the year 2020 – more than a third of them will be “smart” devices of our everyday life, communicating and interacting in the Internet of Things (IoT). In this context, energy supply is known to be a critical point: The smart objects need to be energy self-sufficient in order to  make the operating time as long as possible. Within the project “EnSO” (Energy for Smart Objects), 39 partners from eight countries cooperate to establish new solutions for an intelligent energy supply.

Within the project, Fraunhofer EMFT scientists will develop concepts and technologies for integrating and embedding electronic microchips into autonomous energy supply units. The height of the compact packages is expected to be far less than one millimeter. Furthermore, the packages shall be mechanically flexible, and thus adaptable to diverse ambient designs. To meet this specification, the Munich scientists plan to embed a very thin, flexible microchip into an ultra-flat foil-based housing. For bonding, diverse technological concepts will be probed: Besides Flip-Chip-solutions, where the chip is placed, bonded and embedded on the wiring foil face-down, also new technologies will be applied, where the chip is placed on a foil face-up and embedded with a casting compound. The bonding as well as the  wiring level with external interconnections will be implemented by means of established processes of thin-film lithography.

While the first EnSO-demonstrator for an ultra-thin foil package will still be based on Flip-Chip technology, microchips with face-up configuration are expected to be used already in the next generation of foil packages.

Application

The project partners aim to develop so-called AMES (Autonomous Micro Energy Sources). AMES combine several elements like energy harvesting, energy management and micro energy storage systems, ideally allowing for a lifelong operating period.

Partner

  • AED ENGINEERING GMBH, Germany                                                                                                 
  • AGENCIA ESTATAL CONSEJO SUPERIOR DE INVESTIGACIONES CIENTIFICAS/ Institute of Microelectronics of Barcelona IMB-CNM, Spain                                                                                     
  • AIRBUS DEFENCE AND SPACE, Germany                                                                                           
  • ALPWISE, France                                                                                                                                         
  • APPLIED MATERIALS GMBH & CO KG, Germany                                                                                            
  • BASF SCHWEIZ AG, Switzerland                                                                                                            
  • CESKE VYSOKE UCENI TECHNICKE V PRAZE, Czech republic                                       
  • COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES, France                                    
  • EDITAG SAS, France                                                                                                                                   
  • ENERBEE, France                                                                                                                                         
  • Evalan BV, Netherlands                                                                                                                                            
  • FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG (Fraunhofer-Institut für Integrierte Schaltungen IIS, Fraunhofer - Einrichtung für Mikrosysteme und Festkörper - Technologien EMFT), Germany           
  • GAS NATURAL SDG SA, Spain                                                                                                                 
  • GEMALTO SA, France                                                                                                                                
  • GN RESOUND AS, Denmark                                                                                                                    
  • GREMAN UMR 7347/ Université de Tours - CNRS - CEA – INSA, France                               
  • HENKEL ELECTRONIC MATERIALS, Belgium                                                                                       
  • IDNEO TECHNOLOGIES SL, Spain                                                                                                           
  • Maastricht Instruments, Netherlands                                                                                                
  • MEYER BURGER, Netherlands                                                                                                
  • NEDERLANDSE ORGANISATIE VOOR TOEGEPAST/ NATUURWETENSCHAP ONDERZOEK, Holst Center, Netherlands                                                                                                                                                   
  • NORDSON BV, Netherlands                                                                                                                    
  • O-FLEXX TECHNOLOGIES GMBH, Germany                                                                                      
  • OJMAR SA, Spain                                                                                                                                         
  • OPHTIMALIA, France                                                                                                                                 
  • PRAYON S.A, Belgium                                                                                                                                
  • SKF BV, Netherlands                                                                                                                                                 
  • SKF FRANCE, France                                                                                                                                   
  • SOLEMS SA, France                                                                                                                    
  • STMICROELECTRONIC (TOURS) SAS, France                                                                                    
  • UNIVERSITE DE LIEGE, Belgium                                                                                                              
  • UNIVERSITE DE LORRAINE / CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE, France
  • UNIVERSITE FRANCOIS RABELAIS DE TOURS / CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE
  • UNIVERSITEIT MAASTRICHT, Netherlands                                                                                                       
  • VON ARDENNE GMBH, Germany

Funding

The project is promoted by the ECSEL-Initiative within the European Framework Program for Research and Innovation “HORIZON 2020” and by the BMBF (German Federal Ministry for Education and Research)..