REFERENCE - Elektronic modules for future generations of mobile communication

Outline

The European joint project REFERENCE, coordinated by SOITEC, aims to bundle competences in the field of microelectronics throughout Europe and to initiate a cooperation along the transnational value chain. Within the project, innovative production processes shall be developed for novel high frequency (HF) technologies for electronic modules for future generations of mobile communication, such as 4G+ or 5G. For this, the partners plan first-time production of HF substrates on 200 mm and 300 mm wafers. This extension on optimized HF substrates (200 mm and 300 mm) would allow for HF modules with higher integration density and bandwidths, thus enabling higher data rates and lower production costs.

The focus of the Fraunhofer EMFT activities is on developing integrated circuits for the frequency synthesis, targeting at optimized high frequency characteristics due to the superior substrates.

 

Application

The partners plan to pave the way for a worldwide competitive volume production of complete next generation HF modules in Europe. The performance of this new technology shall be exemplarily demonstrated with HF modules for the new Avionik bandwidth (4.3.-4.4. GHz) in the aerospace industry, allowing for wireless communication in aircrafts.

Partner

  • Airbus Innovation Group
  • Globalfoundries
  • Sentronics Metrology GmbH
  • Siltronic AG
  • AED Engineering
  • Fraunhofer EMFT, Fraunhofer IIS, Fraunhofer IZM
  • TU Dresden
  • Universität der Bundeswehr
  • SOITEC
  • ST Microelectronics
  • Telit Automotive Solutions
  • CEA-Leti
  • Universität Lyon
  • IMEC
  • Ferfics
  • Nanium S.A.

Funding

The project is promoted by the ECSEL-Initiative (Electronic Components and Systems for European Leadership) within the European Framework Program for Research and Innovation “HORIZON 2020” (GA No.: 692477-2) and by the initiative “IKT2020” of the BMBF (German Federal Ministry for Education and Research; Funding code 16ESE0121).