The Oberpfaffenhofen Trainings & Analytics center was integrated with the Fraunhofer EMFT effective on January 1st, 2017. Its branch is home to both the Micro-Mechatronics Center (MMZ) and the Center for Interconnection Technologies (ZVE). All topics relating to simulation, micro-mechatronics, interconnection technology, crimping, encapsulation and components are researched. Certified training in soldering is also provided.
The integration of electronic systems and micro-mechatronics also leads to fundamental changes in the application, namely the merging of form and function. Industry sectors like aeronautics and space travel, medical engineering and automotive technology are looking for light, functionally integrated, cost-efficient and highly reliable alternatives to conventional multicomponent parts, which are usually screwed, glued or plugged together (mechatronics).