Fraunhofer EMFT

Fraunhofer Research Institution for Modular Solid State Technologies EMFT

Project of the month - „Microwave Prize 2013“

for Fraunhofer EMFT and research partner Sony

A Fraunhofer EMFT research team works together with Sony on a "System-in-Package" (SiP) - concept for the integration and interconnection of high frequency (HF)-Chips. The HF-wiring concept aims at embedding very thin high frequency chips in cavities on the surface of a silicon wafer, and implementing the direct electrical contacts with a dual-layer circuit structure afterwards.