Fraunhofer Institute for Electronic Microsystems and Solid State Technologies EMFTThe SmartMan project aims to make semiconductor packaging production intelligent and sustainable in order to manufacture error-free and resource-efficient electronics. The focus is on the use of new, online-capable analysis modules that respond specifically to production errors.
On the path to error-free semiconductor manufacturing: SmartMan project
Laboratory for evaluating the performance of gas measurement methods and gas sensors.
The subproject of the Fraunhofer Institutes EMFT and ENAS focuses on the development of new experimental analysis and testing methods and the creation of digital twins. The aim is to identify risks that can lead to errors and premature failures due to unavoidable fluctuations in material and process properties during manufacturing.
To investigate these defects—which fortunately occur only rarely in real manufacturing—in a realistic manner, defects are intentionally introduced into the test components that are stacked using specialized Solid-Liquid Interdiffusion (SLID) bonding process. Researchers at Fraunhofer EMFT identify, test, and analyse, these defects by collecting electrical data of chips during special stress test, the so-called in-situ HAST test. In addition to defects introduced during SLID bonding process, the team also examines the separation of chips by sawing. This online-test simulates the long-term operation of the components in an accelerated test environment, enabling more accurate predictions of product lifetime and stability.
Higher performance and reliability of chips and chip stacks
The goal is to determine how often a special SLID bonding process will introduce defects that affects the robustness of individual chips and chip stacks.
The assessment of the sawn chip stacks—whether properly sawn or intentionally sawn to produce defects—is carried out in collaboration with the project partner Infineon.
The significant increase in the performance and reliability of chips and chip stacks achieved in the project represents an important contribution to sustainably and long-term strengthening the competitiveness of German industry, particularly in key sectors such as automotive electronics.
The project is funded by the Federal Ministry for Economic Affairs and Energy (BMWE) under grant number 13IK033F.