Humidity-heat chamber |
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2 climate chamber |
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Alternating climate chamber |
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Precision Temperature Forcing System |
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Constant climate chamber |
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High-current laboratory power supply |
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Electrodynamic vibration system |
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Tensile/compressive material testing machine |
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Cross-section analysis
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Stereo and transmitted light microscopes with image analysis |
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Confocal microscopy & profilometry (optical, tactile) |
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Atomic force microscopy (AFM) |
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High-resolution scanning electron microscopes SEM with EDX analysis |
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IR photon emission microscopy & thermography |
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X-ray inspection system with high-performance µCT scanning |
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Reflectometry & ellipsometry |
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FTIR spectroscopy |
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MD-PICTS |
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Source meter, teraohm, and picoamperemeter |
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Contaminometer |
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Dip solder bath with SPS control |
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Bond pull and bond ball/die shear tests |
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High-precision 5-axis CNC milling machine with integrated layer thickness sensor |
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Chemical-mechanical polishing and grinding system (CMP) |
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Infrared (IR) laser system |
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Ion beam etching system "IntlVac Nanoquest I" |
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ICP-RIE plasma etching system |
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Scanning electron microscope for chip scanning, "Raith 150 Two" type |
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Dual-Beam Focused Ion Beam/Scanning Electron Microscope system, "Raith Velion" type, for precise processing and modification of ICs |
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High-resolution scanning electron microscope, Zeiss Gemini 560 type, for analysis and process control |
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Additional equipment for processing and process control |
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Additional equipment for chip analysis |
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Cryostat (temperature <10 mK) |
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Transmission Line Pulser TLP |
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Human Body Model HBM Tester (component-level testing) |
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Human Body Model HBM Tester (system-level testing)
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Charged Device Model CDM Tester |
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Capacitively Coupled Transmission Line Pulsing CC-TLP |
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Robustness test bench (EMC scanner) |
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Additional equipment |
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