Fraunhofer Institute for Electronic Microsystems and Solid State Technologies EMFTAt Fraunhofer EMFT, a key focus of our microsystem integration activities is heterogeneous 3D integration - a transformative approach that enables compact, high-performance, and multifunctional systems-on-chip and systems-in-package. Our 3D integration solutions are protected by numerous patents covering essential process steps, materials, and system architectures - making our platform both technologically advanced and IP-secure for industrial deployment. This integration technology plays a vital role in linking CMOS-compatible electronics with MEMS-based sensors, combining diverse functionalities into miniaturized, high-performance systems. These sensors can be read out, controlled, and networked using standardized interfaces - providing the foundation for Internet of Things (IoT) ecosystems across industries.
3D Heterogeneous Integration
Patented solutions from Fraunhofer EMFT for AI, IoT, 5G, and quantum technologies
Real-World Impact: Applications of 3D Heterogeneous Integration
3D heterogeneous integration is no longer just a research topic—it is powering the devices and systems of today and tomorrow. High-volume applications such as 3D stacked image sensors and 3D memory chips are already enabling advanced mobile devices and data infrastructure.
Building on this foundation, Fraunhofer EMFT supports industry in developing chiplet applications and system-in-package (SiP) solutions for a wide range of high-impact applications, including:
- Artificial Intelligence / Machine Learning (AI/ML)
- IoT and Edge Computing
- Beyond-5G and 6G Communications
- High-Performance Computing (HPC)
- Advanced Sensor and Embedded Systems
- Medical and Scientific Instrumentation
- Quantum Technologies, such as Superconducting and Trapped-Ion Quantum Computing
Technology Leadership: Our Capabilities in 3D Integration
Fraunhofer EMFT offers access to state-of-the-art process technologies, including including Solid-Liquid-Interdiffusion (SLID) bonding and ZiBond®, a low-temperature wafer bonding solution (around 200 °C) that supports reliable, scalable system integration - especially beneficial for thermally sensitive components.
Key advantages of our integration processes include:
- High-density interconnects with pitches down to 5 μm
- Cost-efficient manufacturing - optional through TSV-free architectures
- Mechanical and electrical interconnects in a single process step
- CMOS and MEMS co-integration on wafer and die level
These capabilities empower our partners to realize ultra-compact, high-performance microelectronic systems that are ready for production and tailored to application-specific requirements.
