Systematic analysis for Quality and Compliance

Expert Error Analysis, Originality Checks, and IP Patent Infringement Services

The on-going miniaturization in the microelectronics and semiconductor technologies has lead to a significant increase of requirements on electronic components and systems. Due to the complexity and variety of possible fault mechanisms, failures and malfunctions can present a serious challenge especially for SMEs. In this context, the scientists at Fraunhofer EMFT use their many years of experience and expertise to offer various services across all levels of electronics in the fields of failure and defect analysis, quality and reliability evaluation, authenticity verification of components and process support. The Fraunhofer EMFT not only offers individual component analyses, but also a consistent series of investigations from system to chip level. 

Our services at a glance

Hochauflösende Wärmebildanalysen von Einpressverbindungen
© Fraunhofer EMFT / Bernd Müller
High-resolution thermal image analysis of press-fit connections
  • Analysis using light-optical and X-ray inspection, cross-section preparation and scanning electron microscope (SEM)Qualification tests and reliability tests of printed circuit boards, electronic assemblies and auxiliary equipment
  • Evaluation according to IPC; ESA or DIN
  • Qualification testing for ESA projects - ESA-Accepted Qualification Lab
  • Risk analysis and process optimization as well as development of test methods and equipment
  • Failure analysis
  • Reverse Engineering

Further analyses at IC & component level

  • State-of-the-art tools for analyzing individual components with regard to reliability, originality, IP infringement and failure analysis
  • Security laboratory certified according to Common Criteria - Evaluation Assurance Level 6 (CC-EAL6) for the examination of security-relevant components
  • Full-surface planar preparation of individual metal layers of an IC with GDSII conversion and examination for IP infringement or malignant manipulation
  • In-depth analysis of robustness and ESD investigations in cooperation with the electrical measurement technology expert group
Entkapselter Baustein auf Platine
© Fraunhofer EMFT
Decapsulated module on circuit board - electrical control of the module is still possible

Would you like to find out more about systematic analyses with regard to error analysis, quality assurance, originality checks and IP patent infringement in practice?

Then get in touch with us!


You could also be interested in:


Failure Analysis of Electronic Components and Systems


Package & Chip Level Analyses

Labs for Analysis and Test of Electronic Components and Systems