Integrated Solutions: A Systematic Analysis for Quality and Compliance

The on-going miniaturization in the microelectronics and semiconductor technologies has lead to a significant increase of requirements on electronic components and systems. Due to the complexity and variety of possible fault mechanisms, failures and malfunctions can present a serious challenge especially for SMEs. In this context, the scientists at Fraunhofer EMFT use their many years of experience and expertise to offer various services across all levels of electronics.  These include defect and failure analyses, quality assurance, reliability assessments, authenticity checks on components, and process-oriented consulting based on Fraunhofer EMFT's own methodological developments and research results. In addition to machines and processes developed in-house, the team also uses all common and long-established methods and processes. 

The failure analyses are not only aimed at fixing symptoms, but in particular at systematically identifying the underlying causes of failure. The institute not only offers analyses of individual components, but also pursues a holistic, scientifically sound investigation approach – from the system level down to the chip level.

Methods for analysis, qualification, and reliability assessment

• Analysis using light-optical and X-ray inspection, cross-section preparation and scanning electron microscope (SEM)Qualification tests and reliability tests of printed circuit boards, electronic assemblies and auxiliary equipment
• Evaluation according to IPC; ESA or DIN
• Qualification testing for ESA projects - ESA-Accepted Qualification Lab
• Risk analysis and process optimization as well as development of test methods and equipment
• Failure analysis
• Reverse Engineering

Further analyses at IC & component level

• State-of-the-art tools for analyzing individual components with regard to reliability, originality, IP infringement and failure analysis
• Security laboratory certified according to Common Criteria - Evaluation Assurance Level 6 (CC-EAL6) for the examination of security-relevant components
• Full-surface planar preparation of individual metal layers of an IC with GDSII conversion and examination for IP infringement or malignant manipulation
• In-depth analysis of robustness and ESD investigations in cooperation with the electrical measurement technology expert group

Would you like to find out more about systematic analyses with regard to error analysis, quality assurance, originality checks and IP patent infringement for your product optimization?

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