Fraunhofer Institute for Electronic Microsystems and Solid State Technologies EMFTHigh-voltage ASICs that bring MEMS technology from lab to product - enabling compact, energy-efficient solutions for medical, industrial, and portable applications.
High Voltage ASIC Design for MEMS
ASIC for driver electronics of micropumps
Full-Stack High-Voltage ASIC Design - From Concept to Silicon
With deep expertise in high-voltage mixed-signal IC development, our circuit design team covers every step needed to bring MEMS-driving ASICs from an initial idea to a tested chip. At the core of our work are low-power capacitive DC-DC step-up converters capable of delivering output voltages up to 100 V, combined with digital interfaces for on-chip programming and calibration. The complete design process, from system-level modelling and circuit design to layout, verification and lab characterisation, is carried out in-house using industry-standard Cadence tools to ensure reliable, production-ready results. Refrence projects include single- and multi-channel HV driver ASICs for micropumps as well as for capacitive (CMUT) and piezoelectric (PMUT) micromachined ultrasonic transducers.
Enabling Next-Generation MEMS Applications
Piezoelectric and capacitive MEMS devices are at the heart of portable, wearable, and industrial systems. Our HV ASICs enable the creation of miniaturised, low-power solutions for use in medical wearables, such as micropumps for drug dosing, continuous glucose monitoring and ultrasound smart patches, as well as for industrial applications including vibration sensing, precision positioning and pressure or flow measurement. A big amount of MEMS sensor shipments going into portable devices today, the demand for compact, efficient HV drivers has never been higher.