Go flexible: High-density superconducting Interconnects for the future
The operation of such QPUs at extremely low temperatures requires low-noise and ultra-high-density shielded signal connections in order to handle the huge amount of signal lines. A part of our program for quantum technologies deals with replacing the fixed connections used today with Flexible Low-noise Superconducting Interconnects. This innovative approach enables a much easier, more flexible and space-saving installation. With its roll-to-roll line, Fraunhofer EMFT provides efficient and well-proven production technology for the flexible interconnects. The cable and interconnect architecture is generally designed to achieve high wiring density while minimizing noise and heat dissipation. This makes them particularly suitable for cryogenic applications, such as addressing and reading out qubits or driving photon detectors, where many channels must be delivered reliably with minimal interference.
Circuit Design for quantum processors
Fraunhofer EMFT researchers use their comprehensive expertise to realize superconducting quantum circuits for scalable 3D-integrated QPUs. They also design, develop and validate Components and Systems for Cryogenic Electronics such as ASICs with industrial-grade EDA tools and manufacture them at the institute´s semiconductor foundry partners. Fraunhofer EMFT offers electronic systems design including ASIC design to its customers. The main application of such ASICs is to make the target system efficient and/or realize custom functions for a target product. Looking ahead, the integrated circuit technologies Fraunhofer EMFT is working on are required for scaling quantum computer architectures where signal processing with integrated error correction could be implemented close to the QPU for fast feedback and integrated optical or electrical control.
Development and characterization of quantum technologies hand in hand
In addition to our development and design activities, Fraunhofer EMFT provides a wide range of test and analysis techniques for Characterization of Quantum Hardware Components both at room temperature and at cryogenic temperatures of down to 10 mK. This enables us to thoroughly evaluate the quality, performance and reliability of the quantum hardware components developed at the institute. Moreover, we also offer these services to external customers. The results provide valuable insights for optimizing the performance of quantum hardware components.
Fraunhofer EMFTs program for quantum technologies addresses the central key components to make quantum computing fit for real use outside of laboratory environments. The broad interdisciplinary engineering expertise in the fields of micro- and nanotechnology, interconnection technology, 3D integration, chip design, characterization and testing provides a solid and strong basis for developing forward-looking solutions from a single source.