Sensor Technology on Flexible Substrates

Integration of sensor technology on flexible substrates enables extremely low overall height, high flexibility, robustness and lower manufacturing costs, especially in large quantities. The open form factor also allows integration into and onto different surfaces. Fraunhofer EMFT has long-term expertise and an outstanding infrastructure to manufacture such electronic systems on foil efficiently and cost-effectively, using the roll-to-roll process.

Outstanding development examples for foil-based sensor technology at EMFT are very long and very thin pressure sensor strips for undisturbing measurement of air flows as well as microstructured and therefore highly sensitive electrode geometries for capacitive or electrochemical sensors. Fraunhofer EMFT's foil sensors provide ideal solutions for "open packages" that allow both access to the surrounding medium and secure encapsulation of the electronic components. As a unique technology offering, Fraunhofer EMFT also provides the associated integration technology for IC devices and communication interfaces.

These competences in the area of sensor technology on flexible substrates are available at Fraunhofer EMFT for your application topics. We look forward to hearing from you!