Test and Analysis

Fraunhofer EMFT has wide-ranging expertise and professional infrastructure for test and analysis of electric components and systems. The R&D activities include failure analyses, ESD test and protection concepts, component preparation for safety analyses as well as test and characterization of semiconductor components. Additionally, Fraunhofer EMFT has a CC-EAL6 certified secure in-house laboratory.

 

Electrostatic Discharge - ESD

Fraunhofer EMFT is a leader in the research and application of electrostatic discharge (ESD) in microelectronics. With specialized testing methods, custom test equipment, and robust protection concepts, it offers internationally recognized solutions—practical and integrable into development and quality assurance processes.

 

Cryogenic tests of semiconductor components

Fraunhofer EMFT in Munich bridges research and industry by characterizing electronic semiconductor devices such as transistors and memory chips under cryogenic conditions. This enables the evaluation of performance and reliability at extreme temperatures - forming the foundation for innovative technologies.

 

Cryogenics: Characterization of Quantum Hardware Components

Precise measurement methods are crucial for developing superconducting quantum computers to improve the quality, stability, and performance of components such as qubits and signal lines. Fraunhofer EMFT possesses the expertise and equipment to conduct analyses in measurement environments of just a few millikelvin.

 

Systematic analysis for IP and compliance

With miniaturization in microelectronics, demands on components increase - posing a particular challenge for SMEs. Fraunhofer EMFT offers comprehensive services in failure analysis, quality assurance, reliability assessment, and process consulting - from system to chip level.

 

Reliability and Failure Analysis of Electronic Components

In the event of electronics failure, our damage analysis provides clear answers. Fraunhofer EMFT identifies the causes of faults, assesses risks, and helps to prevent future failures, ensuring that electronic systems are safe and durable.

 

IC analysis and package reliability testing

Modern manufacturing carries risks: These include IP infringements, tampering and overlooked defects. Using planar preparation, GDSII conversion and high-resolution microscopes, we analyse your components comprehensively and precisely at every layer, providing CC-EAL6 certification.

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