Press Releases of Fraunhofer EMFT

Oxford, 05 November 2025 – Oxford Quantum Circuits (OQC) and the Fraunhofer Institute for Electronic Microsystems and Solid State Technologies EMFT today announced a strategic partnership designed to accelerate the industrialisation of superconducting quantum technologies. By merging OQC’s system-level quantum expertise with Fraunhofer’s advanced fabrication capabilities, the partnership charts a new course towards scalable, manufacturable quantum computing. The collaboration represents a pivotal step in OQC’s journey towards fabless production, aligning superconducting quantum devices with industry-standard, CMOS-compatible processes that underpin global semiconductor manufacturing.

Agriculture is under considerable pressure to adapt. Climate change, resource scarcity, and growing sustainability demands require efficient solutions. At the same time, farms are expected to remain competitive and ensure reliable food supplies. From November 9 to 15, 2025, seven Fraunhofer Institutes will showcase the role of smart sensor technology, AI-supported analyses, and sustainable materials at AGRITECHNICA in Hannover, Germany (Hall 17, Booth B15).

The topic of chip design has developed into a central strategic competence at the Fraunhofer EMFT in recent years. In order to further optimize its R&D portfolio, the Munich-based institute will cooperate closely with Prof. Dr.-Ing. Rainer Holmer from OTH Regensburg in the future. Such close research cooperation with a Fraunhofer Institute is a unique opportunity for a university of applied sciences and underlines OTH Regensburg's high level of expertise in this field. The focus of the cooperation is on test development in the field of chips and systems, in which Prof. Holmer will provide significant new impetus. For OTH Regensburg, this closer cooperation, which began in 2024, marks a further milestone in positioning Eastern Bavaria as a strong location in the global semiconductor industry.

The development and characterization of scalable quantum hardware is a key factor for bringing quantum computing to real life applications. Researchers at Fraunhofer EMFT are working on innovative approaches to push this development. At this year´s World of Quantum, taking place from June 24-26 in Munich, our research team will present several demonstrators from its quantum technology research program, which showcase the seamless integration of scientific excellence and engineering expertise.

The European Union consortium PREVAIL, created to accelerate the development of next-generation edge-AI technologies, will open its services to external customers in June 2025. Coordinated by the EU’s four leading research and technology organizations (RTOs) - CEA-Leti in France, Fraunhofer-Gesellschaft in Germany, imec in Belgium and VTT in Finland, the PREVAIL project provides a networked, multi-hub platform for prototype chip fabrication in advanced artificial intelligence (AI) technology to EU stakeholders.

On March 31, 2025, at the Hannover Messe, the Research Fab Microelectronics Germany (Forschungsfabrik Mikroelektronik Deutschland FMD) officially unveiled its new Chiplet Application Hub. Designed to serve as a central platform for the development and application of chiplet technologies, the hub aims to bridge the gap between research and industrial use. By working closely with industry partners, the hub accelerates the development of chiplets made in Germany, elevating industrial research to a new level. At the national level, it complements FMD’s role in the Chips for Europe Initiative, further reinforcing Germany’s technological resilience. The hub's research, development, and prototyping activities build on the infrastructure of the APECS pilot line, ensuring direct pathways to industrial application.

Laboratory-cultured cells have been considered as a substitute method to reduce animal testing in drug development or toxicity testing of chemicals for many years. In the T-Sense-3D project, Fraunhofer EMFT researchers are working with partners from industry and research to develop a high-precision analytical tool for assessing the efficacy and toxicity of drugs and chemicals.

The pilot line for “Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems” (APECS) marks a major leap forward in strengthening Europe’s semiconductor manufacturing capabilities and chiplet innovation as part of the EU Chips Act. By providing large industry players, SMEs, and start-ups with a facilitated access to cutting-edge technology, the APECS pilot line will establish a strong foundation for resilient and robust European semiconductor supply chains. Within APECS, the institutes collaborating in the Research Fab Microelectronics Germany (FMD) will work closely with European partners, to make a significant contribution to the European Union´s goals of increasing technological resilience, strengthening cross-border collaboration and enhancing its global competitiveness in semiconductor technologies. APECS is co-funded by the Chips Joint Undertaking and national funding authorities of Austria, Belgium, Finland, France, Germany, Greece, Portugal, Spain, through the “Chips for Europe” initiative. The overall funding for APECS amounts to € 730 million over 4.5 years.

Microelectronics is a key technology in the technical transformation, underpinning everything from everyday objects such as smartphones and ID cards to industrial manufacturing processes and medical diagnostic systems. This makes it all the more important to ensure that electronics are reliable and trustworthy. The Velektronik research platform has teamed up with the Association for Electrical, Electronic & Information Technologies (VDE) to create a new VDE expert group titled Trusted Electronics. It is to function as a central point of contact, bringing industry, the research sector, and government agencies together to advance the topic of trusted electronics in Germany. The group’s objectives are to cultivate awareness of and support for trusted electronics, consolidate existing research activities, transfer research findings into application, and help to shape industry standards.

A new European Union consortium created to accelerate the development of next-generation, edge-AI technologies is installing cleanroom tools and gearing up to design, evaluate, test and fabricate new circuits from across Europe.