Fraunhofer Institute for Electronic Microsystems and Solid State Technologies EMFT
Fraunhofer Institute for Electronic Microsystems and Solid State Technologies EMFT

Roll to roll pilot line for flexible hybrid electronics

Laboratory for Roll to Roll Pilot Line Processing

The roll to roll pilot line laboratory at Fraunhofer EMFT focuses on developing and implementing advanced processes for the manufacturing of flexible and hybrid electronics. Flexible electronics enable the production of electronic components and systems on mechanically flexible substrates, opening up new application areas – from wearable sensing technologies to integrated functional films.

A key focus of the laboratory is the combination of different manufacturing technologies that can be precisely tailored to specific applications. This approach allows the efficient realization of innovative electronic systems on flexible substrates and supports the development of scalable production processes.

Lab for roll to roll pilotline
© Fraunhofer EMFT/ Bernd Müller
Lab for roll to roll pilotline
Screen Printer for Roll to Roll Pilotline
© Fraunhofer EMFT/ Bernd Müller
Screen Printer for Roll to Roll Pilotline

Processes

Digital UV-Lithography

  • Maskless digital photolithography in roll-to-roll processing
  • Lateral resolution up to 5 µm
  • Continuous processing using a “step-and-repeat” approach
  • High registration accuracy for precise patterning
  • Processing of substrates up to 305 mm in width
  • No limitation on substrate length
  • Spray development of the exposed resist layer for fixation and pattern formation

Lamination

  • Lamination of a wide range of films using heated rollers under controlled pressure and temperature
  • Suitable for roll-to-roll processes and continuous production
  • Flexible process control through adjustable parameters: temperature, pressure, and web speed
  • Processing performed using equipment from Stork

Typical Applications

  • Lamination of dry film resist for preparation of photolithographic patterning
  • Passivation using adhesive-coated cover films

 

 

Wet Etching

  • Uniform etching of metallized films in a continuously operating spray etching system
  • Modular system design enables rapid change of the etching medium
  • Suitable for etching a variety of metals

Plasma Etching

  • Surface conditioning and etching of films and polymer coatings in roll-to-roll processing
  • Use of various process gases: nitrogen (N₂), oxygen (O₂), and CF₄
  • Ideal for preparing subsequent process steps (e.g., coating or patterning)

Screen Print

  • Patterned printing of various functional pastes on films in roll-to-roll processing
  • Processable materials: conductive pastes, electroluminescent pastes, dielectrics, and semiconductor pastes
  • Suitable for the fabrication of functional layers and printed electronics
  • Integrated UV and convection oven drying to ensure process stability
  • Automatic pattern recognition for precise alignment of multiple layers
  • Enables the realization of multilayer systems

Laser processing

  • Applications: via opening, patterning and ablation of individual layers, and singulation of components from laminated stacks
  • Cutting of complete film layers possible
  • Creation of markings (text, symbols, codes)
  • Trimming of thin-film resistors for precise electrical properties
  • Positioning accuracy up to 10 µm

Roll-to-Roll Assembly

  • Automated assembly and electrical contacting of film-based components
  • Integration of subsystems such as flexible batteries, displays, and solar cells
  • Placement on a base substrate (sheet or roll)

Roll-to-Roll Chip Bonding

  • Roll-to-roll processing from bare dies to SMD components
  • Component feeding via wafers, trays, or reels
  • Assembly possible in face-up or flip-chip configuration
  • Electrical contacting via soldering, ACA bonding, or conductive adhesives
  • “Step & Repeat” processing with highest registration accuracy
  • Substrate width up to 305 mm, with no limitation on substrate length

 

 

 

 

 

 

High-Precision Chip Bonding

  • High-precision bonding and placement system with submicrometer accuracy
  • Placement accuracy: 0.3 µm (3σ)
  • Alignment accuracy: 0.08 µm
  • High bonding force up to 1000 N
  • Enhanced process support through process gases (N₂ / formic acid)
  • Integrated UV curing
  • Ideal for the development and prototyping of high-end bonding technologies
  • Suitable for ultra-fine-pitch flip-chip bonding, thermocompression bonding, and assembly under controlled atmosphere

 

Metallization

  • Drum-based roll-to-roll PVD sputtering system 
  • Continuous deposition on polymer films (PET, PI) with up to 300 mm web width 
  • In-line plasma pre-treatment unit (etching / cleaning) and four DC magnetron sputter sources
  • Fully automated process control for high uniformity multilayer metallic thin-film stacks

Leverage Fraunhofer EMFT's technologies in a roll to roll pilot line for flexible hybrid electronics for your application needs.

Contact us to discuss how we can support your projects!

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