Silicon Semiconductor Technologies

The researchers at Fraunhofer EMFT possess long-term experience in the area of silicon semiconductor technologies. The institut has an own CMOS cleanroom for processing silicon wafers and offers a wide portfolio of single processes and process sequences. Non-CMOS-compatible wafers can be processed in a separate MEMS line. Extensive measurement infrastructure is available for characterization of silicon wafers. Development of highly sensitive low-noise semiconductor components for detection of low level signals, adaptable for application-specific requirements, is a core competence of Fraunhofer EMFT.

Components

 

Low-noise JFET

The low-noise JFET transistors developed at the Fraunhofer EMFT allow for extremely low-noise amplifiers. Therefore they offer great optimization potential e.g. for material analysis, recycling or security applications. 

 

Low-noise Diodes with Variable Capacity

Fraunhofer EMFT develops high-quality, low-noise variable capacity diodes. An optimized manufacturing process makes the diodes suitable for high-end applications such as variable capacitance oscillators at GHz frequencies.  

 

IDT - Interdigital Transducer

Interdigital transducers (IDT) are the core components of electrochemical sensors. At Fraunhofer EMFT, these components are available for impedimetric, amperometric or potentiometrich measurements and can be adapted to application-specific requirements 

Processes and Technologies

 

3D Heterogeneous Integration

Heterogeneous 3D Integration is a key enabling technology for implementation of miniaturized multifunctional high-performance microelectronic components and sensor systems via vertical connections between subsystems.

 

Wafer-based Superconducting Qubit Fabrication Processes

The superconducting qubit architecture is one of the leading candidates to realize general-purpose quantum computing. Fraunhofer EMFT aims to achieve scalability of superconducting qubits beyond 1000 qubits with foundry-like fabrication processes. 

 

CMOS Line

The Fraunhofer EMFT 200  mm CMOS cleanroom allows for CMOS-compatible processing of silicon wafers down to 0,34 µm structural resolution. The technology is used for development and processing of sensors, actuators, special components. Layouting and comprehensive process characterization complete the offering.

 

MEMS Line

The Fraunhofer EMFT cleanroom offers access to modern technologies for fabrication of Micro-Electro-Mechanical Systems (MEMS).

MEMS processes enable integration of mechanical components with microelectronics and silicon chips, deployed in various application areas, such as sensors, actuators and microfluidics.

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