Process development for Microsystems and Semiconductor Components

Sensors and actuators used in a wide variety of applications today, are typically tiny micro-electro-mechanical systems (MEMS) — a combination of mechanical and electronic components packed into a very small space. Creating them requires complex technologies and processes for developing minute structures at the micro- and nanometer scales. To this end, proven methods from semiconductor technology — which are also used to manufacture integrated circuits — are often employed. The processes for realizing such microsystems and semiconductor components often involve hundreds of process steps requiring sophisticated cleanroom technology and equipment, which entail substantial investments and high operational costs. Custom designs for low-volume applications and flexible manufacturing in small batches with varying component geometries are difficult to implement in industrial semiconductor foundries.

© Fraunhofer EMFT / Bernd Müller
Silicon wafer with semiconductor components

The Fraunhofer EMFT research cleanroom is equipped with a wide range of technologies and systems for fabricating custom microtechnological structures. Traditional CMOS technologies can be used to create purely electronic functions, while in the MEMS section of the cleanroom, additional technologies and materials are employed to realize the mechanical properties of the components.

Based on the customer specifications and tailored to the specific application, our experts develop a technology concept, plan its practical execution, and implement the pilot production at wish. 

Requirement clarification and technology concept

From the product idea through the process concept to pilot production, the required development process is systematically planned, developed step-by-step in an iterative manner, and subsequently implemented in the Fraunhofer EMFT cleanroom. Essential to this process is an understanding of the requirements for the target components, their intended function, and the structures required to achieve them. Based on this, a concept is developed for the semiconductor technologies to be used in the cleanroom, which are then optimized with regard to the required electrical characteristics, yield, and manufacturing tolerances.

Tailored process development

Based on the technology concept, a concrete process chain is developed, verified through iterative test runs, and adapted to the line’s cleanliness requirements. In this process, various process parameters, contamination, and quality metrics must be considered simultaneously and coordinated with one another.

Subsequently, a process sequence consisting of individual processes is designed, and the necessary material and media concepts are defined. The actual process development takes place through several test runs on test wafers or demonstrator chips, during which process parameters are systematically varied. In-line and end-of-line analytics are used to verify whether the desired properties and quality requirements have been achieved.

Pilot production and transfer

Once a stable process run has been achieved, the process is transferred to pilot production, where yield, stability, and cleanroom performance are tested across multiple batches. Following pilot production, small-scale production of custom-designed structures and components can be commissioned at Fraunhofer EMFT. Upon request, our experts can also assist you in transferring the processes to an industrial semiconductor manufacturer.

Reference project: Process sequence for manufacturing a microfluidic actuator

  • Objective: Manufacture of a microfluidic actuator for nanoliter-precise dispensing of gases and liquids.
  • Product Concept: A piezoelectrically driven MEMS micropump consisting of three layers which are bonded together during the back-end process. A separate process sequence was developed for each layer for manufacturing in the Fraunhofer EMFT research cleanroom.
  • Substrate: 200 mm silicon wafer

Deployed technologies:

  • Layer deposition: SiO₂ & SiN
  • Contact lithography
  • Stepper lithography
  • Dry etching: DRIE & RIE (Reactive Ion Etching)
  • Wet etching: KOH
  • Si-Si wafer bonding
  • Metallization: Al sputtering
  • Grinding
  • Spin etching
 

Piezo-driven micropumps

Piezoelectric micropumps are key components of microdosing systems. Fraunhofer EMFT offers application-specific solutions with a broad portfolio of silicon, stainless steel and titanium micropumps. A highlight: the world's silicon micropump, measuring mere 3.5 x 3.5 x 0.6 mm3.

Which innovative microsystems and components could we realize together?

Infastructure and technologies for process development at Fraunhofer EMFT:

 

MEMS Line

The Fraunhofer EMFT cleanroom offers access to modern technologies for fabrication of Micro-Electro-Mechanical Systems (MEMS).

MEMS processes enable integration of mechanical components with microelectronics and silicon chips, deployed in various application areas, such as sensors, actuators and microfluidics.

 

CMOS Line

The Fraunhofer EMFT 200  mm CMOS cleanroom allows for CMOS-compatible processing of silicon wafers down to 0,34 µm structural resolution. The technology is used for development and processing of sensors, actuators, special components. Layouting and comprehensive process characterization complete the offering.

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