The Fraunhofer EMFT research cleanroom is equipped with a wide range of technologies and systems for fabricating custom microtechnological structures. Traditional CMOS technologies can be used to create purely electronic functions, while in the MEMS section of the cleanroom, additional technologies and materials are employed to realize the mechanical properties of the components.
Based on the customer specifications and tailored to the specific application, our experts develop a technology concept, plan its practical execution, and implement the pilot production at wish.
Requirement clarification and technology concept
From the product idea through the process concept to pilot production, the required development process is systematically planned, developed step-by-step in an iterative manner, and subsequently implemented in the Fraunhofer EMFT cleanroom. Essential to this process is an understanding of the requirements for the target components, their intended function, and the structures required to achieve them. Based on this, a concept is developed for the semiconductor technologies to be used in the cleanroom, which are then optimized with regard to the required electrical characteristics, yield, and manufacturing tolerances.
Tailored process development
Based on the technology concept, a concrete process chain is developed, verified through iterative test runs, and adapted to the line’s cleanliness requirements. In this process, various process parameters, contamination, and quality metrics must be considered simultaneously and coordinated with one another.
Subsequently, a process sequence consisting of individual processes is designed, and the necessary material and media concepts are defined. The actual process development takes place through several test runs on test wafers or demonstrator chips, during which process parameters are systematically varied. In-line and end-of-line analytics are used to verify whether the desired properties and quality requirements have been achieved.