Enhanced Security Standards Lab

Methods and Processes

• Physical and chemical preparation and opening of packaged IC's while maintaining the the electrical functionality
  
• Mechanical-chemical preparation of IC's and packages on circuit boards, while maintaining the electrical functionality and integrity 
• High resolution optical and scanning electron microscope images
• Reverse preparation of IC's in single metal layers with high resolution full-surface chip scan
• Layout extraction from chip scan images

Equipment and facilities

High precision 5-axis-CNC-milling with integrated sensor for layer thickness

• Mechanical preparation of circuits boards
• Thinning ICs down to single-digit µm scale
• Processing of single components on circuit boards while maintaining the electrical functionality

Infared (IR) laser system       

• Laser marking of components
• Laser processing of components
• Laser marking of trays as a batch process

"IntlVac Nanoquest I" ion beam etching system for homogeneous and high precision processing and ablation of single IC metall layers  

• Purely physical ablation or
• Selective processing with reactive gases possible
• Homogeneous beam diameter of 8cm for high homogeneity of large areas
• In-situ process monitoring by SIMS mass spectrometry

"Raith 150 Two" scanning electron microscope (SEM) for chip scanning           

• Resolution < 2nm/pixel
• High-resolution imaging processes
• High system stability enables extra long scans over several days
• Conversion of single images to stitched layout formats

"Raith Velion" dual-beam FIB/SEM system for precise processing and modification of IC's 

• FIB diameters of components
• Integrated EDX for element analysis
• FIB sources: Si, Au
• Working gases: Pt, XeF2
• SEM for in-situ process control
• Nanomanipulators for EBIC/EBAC measurements

Further equipment for processing and process control  

• High-resolution digital microscope Olympus DSX1000
• Dry-chemical plasma etching system
• High-precision chemical-mechanical polishing machine
• High-resolution profilometer with sensor for thin layers
• SEM with EDX for process control

Entry with status, validity, and associated certificate documents  - BSI Site Certification - Fraunhofer EMFT 

BSI test and certification report on IT security of the site - BSI Site Certification Report - Fraunhofer EMFT 

Scope and measures of the BSI site certification - BSI Site Security Target Lite - Fraunhofer EMFT 

BSI Certification Confirms Security Standards at Fraunhofer EMFT

Fraunhofer EMFT has been certified by the German Federal Office for Information Security (BSI) as part of a site certification process. This certification confirms that defined security requirements for the development and analysis of security-critical microchips are met at the site.

As a result, a trustworthy working environment - tested according to recognized standards - is ensured. The certificate highlights Fraunhofer EMFT’s special expertise in the field of microelectronics and hardware security analysis, and confirms the structured and transparent implementation of security-relevant processes in research.

Leverage Fraunhofer EMFT's security standards test lab for your application needs.

Contact us to discuss how we can support your projects!