Extremely thin silicon chips are required for heterogeneous 3D integration and chip-in-foil packages. The technological know-how for the production of thin wafers provides an important foundation for this. Fraunhofer EMFT is well equipped for the extensive process sequence of thinning technology, so that arbitrarily thin devices can be realized at wafer level. Applications for very thin semiconductor components include 3D IC integration, flexible electronics for sensors on the body, and extremely flat sensor systems for predictive maintenance of plants, machinery and buildings.