Green revolution in the semiconductor industry

By 2030, global semiconductor production is expected to be almost twice as high as it is today. To mitigate the negative environmental impact, 58 European partners in the EU GENESIS project have set themselves the goal of developing more environmentally friendly materials and processes in the semiconductor industry. As part of the project, Fraunhofer EMFT researchers are working on optimizing exhaust gas purification methods and increasing the efficiency and environmental sustainability of production processes. 

By 2030, global semiconductor production is expected to be almost twice as high as it is today. In order to maintain and strengthen Europe's technological sovereignty, the EU states want to increase EU production capacity to 20% of global chips as part of the European Chips Act. This ambitious target is about four to five times the current capacity and brings with it both opportunities and challenges: the massive increase in production will inevitably lead to an increase in negative environmental impacts, including increased energy and water consumption and hazardous waste.

The EU GENESIS project aims to develop environmentally friendly materials, processes and solutions to reduce the environmental footprint of the semiconductor industry. One particular focus is on PFAS-free compounds and process gases with low global warming potential. In addition, scalable, sensor-based systems for monitoring, control and emission reduction will be created to detect and reduce environmental risks from greenhouse gases, PFAS and other hazardous substances. Finally, GENESIS is working on solutions to minimize overall waste and promote the reuse and recycling of materials. The project results will form the basis for a complete and comprehensive European supply chain for greener production, covering materials, processes, equipment and infrastructure.

Optimization of plasma deep etching with environmentally friendly gases

As part of this green revolution, Fraunhofer EMFT researchers are working on new, environmentally friendly materials for semiconductor processes that meet both environmental and performance targets and reduce emissions of PFAS and greenhouse gases. One focus is on the development of a sustainable deep reactive-ion etching process (DRIE) and the stripping of polymers with alternative gases as well as the improvement of fluorine-based plasma processes to remove carbonaceous residues. PFAS-free materials are also being tested for use in the sensor packaging industry. The Fraunhofer EMFT will also contribute its expertise in exhaust gas purification in order to increase the efficiency of a new type of exhaust gas purification system.

Specific goals are the optimization of plasma deep etching with environmentally friendly gases, the complete replacement of CF4 gas with a more environmentally friendly gas mixture in plasma stripping processes and the development of test and characterization methods for PFAS-free sensor packages. The replacement of CF4 gas opens up opportunities for pilot projects and is supported by training courses on the use of the new gases. The development of test methods for PFAS-free materials also creates new opportunities for future sensor developments. In addition, the exhaust gas purification efficiency is to be increased to up to 99.999%. Abatement monitoring will help to determine whether the processes are truly clean.

Green revolution: opportunities and market potential for environmentally friendly solutions

Fraunhofer EMFT will use the results obtained to act as a leading contact for the semiconductor industry, environmental technology companies and research institutes in the field of PFAS reduction and foster the green revolution in this industry. The market opportunities for this are very promising, as the demand for environmentally friendly technologies in the semiconductor industry is constantly growing and is also becoming obligatory, not least due to government regulations on the reduction of pollutants.