Fraunhofer Institute for Electronic Microsystems and Solid State Technologies EMFTEurope, and Germany in particular, have outstanding strengths in microelectronics for automotive, energy, security and industrial applications. In the EU project EuroPAT-MASIP, partners from nine countries are bundling their know-how to lay strategic foundations for the development of innovative and complex electronic systems. This is intended to secure and significantly increase the competitiveness of Europe's microelectronics industry in a global comparison.
Project EuroPat-MASIP: Innovative production technology with self-assembly of chips
Chip Self-Assembly
The German consortium is focusing on multifunctional electronic systems, energy-saving power electronics, design of complex systems and innovative production technologies.
As part of the project, Fraunhofer EMFT is demonstrating the possibility of carrying out pick-and-place processes with self-assembly. To do this, the researchers adjust the wetting properties of surfaces using low-pressure plasma: metal surfaces become hydrophilic, while the surrounding areas of polyimide become hydrophobic. In the production process, the chips are then adjusted to the (metallic) target areas by a liquid.
The project is funded by the EU under grant number 737497 as part of the ECSEL initiative and by the BMBF under grant number 16ESE0260S.