Electrical Interconnection Technologies

Increase in requirements for reliable, efficient and sustainable signal and power lines of mechatronic systems present whole new challenges for providers of electrical interconnect technologies. Especially for the future functionalities of automated driving, the failsafe performance of function-critical electrical components and reliable data transmission are of utmost importance. Based on their long-term experience in the area of electrical interconnect technologies, the Fraunhofer EMFT experts support their industrial customers with tackling these challenges. 

Degradation processes of connectors are a common cause for problems in the field, especially when they lead to immobilized vehicles. Regarding the functionalites of automated driving, it is important to detect the initiation of such failures as early as possible. The Fraunhofer EMFT test stands allow for analysis of the reliability and long-term behavior of electrical interconnections. Especially the determination of the electrical characteristics of contacts, plugs and connectors regarding fretting corrosion or vibration results in broad understanding of the long-term reliability of the interconnection technology in question.

For the selection of the suitable electrical interconnection technology, knowledge of the ageing and failure behavior is of essential importance. Development of efficient and application-specific solutions in an early phase of the product development process can be facilitated by analysis of the thermic and mechanical behavior of the first concepts.

Fraunhofer EMFT supports its customers already in the concepting phase with the selection of the right materials optimized for the application. The material properties are crucial for the functionality of the single components. The expert knowledge on the interaction between the manufacturing process, mechanical stress and failure mechanisms is used for product improvements respectively. For this purpose, the materials are thoroughly analyzed in the Fraunhofer EMFT test and analysis labs.

Additionally, the Fraunhofer EMFT test stands and innovative HiL applications facilitete focussed and efficient investigation of thermic and mechanical failure causes. The established findings provide new approaches for design assessment and optimization.

The Fraunhofer EMFT design assessment competences draw on the experience from more than 40 years of trainings in the ZVE center for electrical interconnection technologies, providing the team with extensive know-how in soldering, hand soldering, connection technologies and crimping. 

Determination of the current carrying capacity and derating curves according to DIN IEC 60512

Determination of the current carrying capacity of electrical connections is a prerequisite for analyzing the reliability of the power transfer at various ambient temperatures. A standard-conform investigation of the current carrying capacity of electrical connections can be carried out in the Fraunhofer EMFT derating test consoles. Monitoring the heat transmission within the system is possible via thermal imaging.

Investigation of the mechanical properties 

In the labs for soldering, crimping, press-fitting and ultrasonic welding, the conformity of the mechanical properties of electrical connections with various norms, standards or supply agreements can be tested (tear-, pressure-, shear strength, relaxation and creep tests, etc.).  

Reliability tests in various environmental conditions 

Various environmental conditions can be simulated in the Fraunhofer EMFT climatic chambers. Additionally, simultaneous mechanical stress and vibration can be induced, in order to analyze the long-term reliability and failure behavior of electrical connections.

For the functionality of automated driving it is essentially important to be able to detect the initiation of possible failure mechanisms due to degradation processes of electrical connections as early as possible. The contactless electronic sensor system - "Cyber-physical Connector" - developed by Fraunhofer EMFT allows for reliable condition monitoring of connection systems. The scalable measurement system provides a diagnosis interface for securing the availability of electronic devices. Relevant data, such as temperature or current, is determined close to the connections, and wirelessly transmitted for further analysis. The optimized packaging concept allows for the realization of the system in the smallest of spaces. The reliability of the sensor system at high temperatures and vibration has been tested and verified with an example of a printed circuit board connector. 

This service offering in the area of Electrical Interconnect Technologies is available at Fraunhofer EMFT for your application topics. We look forward to hearing from you!