Fraunhofer Institute for Electronic Microsystems and Solid State Technologies EMFTElectrical connections and connectors are critical to the reliable operation of electronic systems. They must meet electrical, mechanical, and thermal requirements and function reliably even under demanding operating conditions. Fraunhofer EMFT supports companies in the development, design, and optimization of electrical connections and connectors - from design and numerical simulation to experimental validation and quality assessment.
Design of Electrical Connections and Connectors
Dr.-Ing. Anqi Li working on a press fit simulation at the Fraunhofer EMFT in Weßling
Our Services for Electrical Connectors
- Connector Design and Engineering: Consulting on materials, design, and engineering, as well as the development and optimization of reliable contact points, taking application-specific requirements into account.
- FEM Analysis and Service Life Prediction: FEM-based evaluation of electrical connections and solder joints under thermal, mechanical, and thermomechanical loads, as well as service life prediction.
- Design and Modeling of Solder Joints: Design of solder joints and solder volumes, as well as evaluation of relevant requirements and standards, such as IPC Class 3.
- Expert Consulting and Quality Assessment: Consulting from the concept phase through to mass production, as well as assessment of the quality of electrical connection points—from solder joints to plug contacts.
Numerical Simulation and FEM
Numerical simulations support the design process even in the early stages of development. Using the finite element method (FEM), Fraunhofer EMFT analyzes mechanical, thermal, and thermomechanical stresses in electrical connections and connectors. This allows for the evaluation of different design variants, the identification of critical areas, and the optimization of connection solutions.
Application Examples
Connectors for Cryogenic Applications
In Munich Quantum Valley (MQV), Fraunhofer EMFT is working on the further development of superconducting qubit platforms. An innovative connector ensures precise connections between flexline and PCB. Thermal simulations are used to investigate the behavior of the connection at cryogenic temperatures.
Press-fit technology in drive technology
Press-fit technology offers an innovative solution for contacting processes in drive technology. By developing a test bench and a numerical model, Fraunhofer EMFT analyzes the stress distribution and the press-fit connection process between the press-fit pin and copper sleeve. This enables the optimization of process stability and prevents component damage.
Press-fit pin in multilayer printed circuit board: Experiment
Press-fit pin in multilayer printed circuit board: Numerical simulation
Thermal simulation for soldered joints
The Fraunhofer EMFT team uses thermal simulations to optimize the soldering process and ensure stable electrical connections. By analyzing the temperature distribution and thermal gradients, soldering processes are made more efficient and the quality of the soldered joints is improved.
Heat transfer in copper and thermoplastic in the base material using transient thermal simulation.