The APECS Pilot Line for Advanced Packaging and Heterogeneous Integration provides access to design, development, testing, and pilot production, helping move technologies from research to industrial application. Prof. Dr. Holger Hanselka, President of the Fraunhofer-Gesellschaft, emphasizes that this transfer can succeed only through close collaboration between research and industry: “Europe’s future in microelectronics will be decided not just by roadmaps and in the labs, but by joint efforts of industry and scientific organizations to rapidly translate research excellence into scalable industrial technologies.”

From research to production: How Europe can translate research and investment into industrial strength

The new FIRST by FMD forum focuses on the political and economic conditions needed for this transition and the technological strengths Europe can build on. Sessions, panel discussions, technological deep dives into key topics for the European semiconductor ecosystem, and strategic spotlights bring together a range of perspectives. The program covers both access to infrastructure and the stable framework needed for the transition to industrial manufacturing.

“Supporting process development capabilities is much needed and appreciated. However, we also need policies allowing for flexible scale-up and sustainable long-term supply,” says Michael Hosemann of Siemens Healthineers. The importance of these broader framework conditions is also reflected at the policy level. Alexandra-Gwyn Paetz of the Federal Ministry of Research, Technology and Space (BMFTR) emphasizes their strategic significance: “Germany's position in microelectronics has far-reaching implications for our innovative strength – and thus also for our industrial competitiveness, technological sovereignty, and economic resilience. Our High-Tech Agenda therefore strengthens microelectronics as a key enabling technology.”

Against this backdrop, the further development of the EU Chips Act raises the question of what Europe needs for the next phase of its semiconductor strategy. The Chips Act 2.0 must support industrial scaling and long-term value creation in Europe alongside research and new production capacity.

One concrete expectation for how this should translate into policy comes from Carsten Salewski of Viscom: “In my view ‘EU added value’ in Chips Act 2.0 must be EU made production equipment for ‘new or substantially upgraded facilities for electronics manufacturing or integration’.”

Advanced packaging, chiplets and design: Where Europe’s opportunities lie

Europe can strengthen its strategic position by building on its existing capabilities in advanced packaging, heterogeneous integration, chiplets, and chip design. Marcel Schäfer of TRUMPF highlights the importance of packaging in this context: “Advanced Packaging is the next battlefield. Europe needs packaging sovereignty alongside fab sovereignty. Laser beam-shaping enables chiplet integration at scale.”

Chip design is equally important to Europe’s position in this technological landscape. As Thomas Heurung of Siemens EDA notes: “Speed is of the essence in semiconductors. AI-enabled EDA and Europe’s chip design platform help startups reach PoC, funding and customers faster.”

The role these technologies and the infrastructure they require can play in Europe’s semiconductor strategy is a core part of the FIRST program. They will also feature on the event’s Demo Street, a dedicated showcase area where visitors can explore technologies and specific applications in power electronics, advanced packaging, radio frequency, MEMS, sensors, and photonics and speak directly with experts on site.

Leading organizations from across the microelectronics sector

FIRST brings together leading organizations from across the European semiconductor ecosystem. Semiconductor manufacturers such as GlobalFoundries, Intel, STMicroelectronics, NXP, and UMS will meet equipment and integration providers including ASML, ASMPT, TRUMPF, Viscom, and Comet. Siemens EDA, EuroCDP, and the Chipdesign Germany network represent Europe’s design infrastructure, while Bosch, Audi, Siemens Healthineers, HENSOLDT, and Thales bring requirements from key application sectors into the discussion. Representatives of the European Commission, the Chips Joint Undertaking, and the BMFTR, along with representatives from the FMD and universities, contribute perspectives from policymaking and research.

Media accreditation for FIRST by FMD is now open. Media representatives interested in covering the event can register at www.first-by-fmd.de.