Fraunhofer Institute for Electronic Microsystems and Solid State Technologies EMFTModern electronics places the highest demands on efficiency, safety and reliability. Reliable electrical connections are a key factor – from individual contact points and solder joints to connectors and optimally matched cabling. At Fraunhofer EMFT, we combine decades of experience from a wide range of internal and external research projects to develop, analyze and assess connectors and electrical connection solutions for demanding applications. Our experts rely on precise analyses, FEM simulations and standards-compliant testing. This enables the functionality, reliability and lifetime of electrical connections to be assessed and systematically optimized at an early stage of development.
Efficient power transmission
Reliable Connectors for Demanding Applications
Monitoring of electrical connections and power transmission with sensors
Our services in power transmission
- Connector design and development: Consulting on materials, contact concepts and geometries, as well as the design and development of standards-compliant contact interfaces
- FEM analysis and lifetime prediction: Customized FEM simulations for modeling and assessing solder joints and contact areas under thermal and mechanical loads, including lifetime prediction under thermo-mechanical loading
- Design and modeling of solder joints: Consulting on the design of solder joints and solder volumes, taking relevant standards and specifications into account, for example to achieve IPC-compliant solder joints; assessment and derivation of requirements in accordance with IPC Class 3
- Expert consulting and quality assessment: Systematic support from the concept phase through series production, particularly for early design decisions, as well as quality assessment of electrical connection points (e.g., solder joints, contact interfaces)
- Failure analysis and monitoring: Precise investigation of electrical connections (e.g., soldered, crimped and press-fit contacts) and conductors (cables, buses) under realistic operating conditions; simulation of physical, chemical, electrical and thermal loads and identification of potential weaknesses
- Test procedures and documentation: Combination of standardized and application-specific test procedures for assessing electrical connections, including comprehensive documentation and evaluation of test results
- Monitoring: Real-time measurement of current and temperature during operation using an intelligent connector developed at Fraunhofer EMFT
Examination: precise failure analysis of electrical connections and conductors
To identify failures (defects) in electrical connections and connectors, including soldered, crimped, press-fit and other contact interfaces, as well as in conductors such as cables and buses, we carry out comprehensive analyses under realistic operating conditions. For this purpose, we simulate physical, chemical, electrical and thermal loads in controlled environments.
Where required, an intelligent connector developed at Fraunhofer EMFT enables real-time measurement of current and temperature during operation. By combining standardized and application-specific test procedures, we determine, among other parameters, maximum power dissipation and reliably identify potential weaknesses and single points of failure. This also includes investigating wear between interacting surfaces (Tribology).
Connector Design and Development
Reliable electrical connections start with the design. Fraunhofer EMFT supports companies in selecting suitable materials as well as in the design and development of connectors and contact interfaces. We take geometric, electrical and material-related parameters as well as specific operating conditions into account. A particular focus is placed on the development and assessment of standards-compliant contact interfaces. Considering materials, geometries and contact concepts at an early stage helps ensure that requirements for functionality, reliability and lifetime are taken into account during the development process. Further information on connectors for high-reliability electronics is available here.
Design and Modeling of Solder Joints
Using the finite element method (FEM), we model and assess solder joints, including the solder and contact areas on the printed circuit board. We investigate their behavior under thermal and mechanical loads and enable lifetime prediction under thermo-mechanical loading. We also provide consulting on the design of solder joints and solder volumes, taking relevant standards and specifications into account. This includes, for example, the design of IPC-compliant solder joints as well as the assessment and derivation of requirements in accordance with IPC Class 3.
Consulting: Customized solutions based on in-depth analysis and FEM simulations
Our consulting services are based on comprehensive documentation of all process steps and the use of state-of-the-art measurement equipment. We analyze not only failure patterns such as elevated temperatures or increased electrical resistance, but also investigate their underlying causes. Using the finite element method (FEM), we develop comprehensible simulations tailored to specific requirements in order to identify and implement optimum solutions. Geometric, electrical and material-related parameters as well as specific operating conditions are taken into account. Our experts support companies from the early design stages through to series production. Where required, we support the development and optimization of connectors, contact interfaces and other electrical connection solutions.