From Research to Application: Projects at Fraunhofer EMFT

In the European project SpikeHERO, Fraunhofer EMFT develops input neurons that turn photocurrents into spikes, plus a SENNA redesign targeting spike rates up to 500 MHz.

SENNA Connect develops a developer kit for the SENNA neuromorphic processor, so you can run spiking neural networks on real hardware instead of in simulation.

In the CFP project, Fraunhofer EMFT, Fraunhofer IZM, and Yamagata University are developing novel chip foil packages for flexible electronics. Together, they are working on materials, interconnection technologies, and an end-to-end process chain to reliably integrate electronic functions into soft, curved, or flexible surfaces. The goal is to create chip foil packages less than 150 micrometers thick that can be manufactured efficiently and sustainably in high volumes and used in medicine, industry, mobility, and other fields of application.

With the foundation of Munich Quantum Valley (MQV) in 2022, seven leading research institutions in Bavaria, including the Fraunhofer Gesellschaft, have committed themselves to an ambitious goal: Building the first German quantum computer with up to 1000 qubits “made in Bavaria”. The partners are working on realizing full-stack quantum-computer demonstrators, remotely accessible to researchers and industry. Within this framework, Fraunhofer EMFT researchers are contributing their engineering expertise to enable scaling and industrialization of the qubit platform based on superconducting qubits.

28 European research partners aim at designing, building and operating a quantum processor of up to 1000 qubits in Europe. As part of the project, Fraunhofer EMFT is providing the development of new fabrication processes for qubit chips, which will facilitate chip manufacturing on an industrial scale for commercial use in the future.

In the EU research project SUPREME, 23 partners from 8 member states are pooling their expertise to advance the development of stable manufacturing processes for superconducting quantum chips. The R&D activities specifically address the challenges related to the stability and yield of qubits – crucial factors for the scaling of quantum technologies and thus for Europe’s competitiveness in the global quantum hardware market.

The research project »Velektronik - Vertrauenswürdige Elektronik (ZEUS)« of the German Federal Ministry for Education and Research (BMBF), aims to establish a networking platform for trusted electronics as an interface between research and industry.

The semiconductor industry and manufacturers of electronic components and systems test their products carefully to ensure that they function flawlessly. An important aspect is the tolerance of chips to ESD (electrostatic discharge). Fraunhofer EMFT and High Power Pulse Instruments GmbH (HPPI) have jointly developed a 2-pin test system that offers many advantages to the semiconductor industry.

Microrelative movements can lead to crack formation and crack growth in press-fit connections. Together with the Institute of Materials Engineering and the Institute of Drive and Vehicle Technology, both at the University of Kassel, Fraunhofer EMFT researchers are working on a suitable accelerating model to better understand how these undesirable effects occur.

Press-fit technology provides an innovative connection method which, due to its high reliability and robustness, is particularly suitable for safety-relevant connection points. Another advantage is that the method is much more eco-friendly than the soldering technique most commonly used to date. A Fraunhofer EMFT research team is working on a predictive model that relates easily accessible material/process data to the reliability of press-fit contacts.

Whether in automobiles – especially in the context of autonomous driving – or future industrial manufacturing: plugs and electrical connection technologies have a key role to play in digital networking. They are the main interface between machines, control units and data processing systems and so they provide the basis for the functionality, simple handling and reliability of automation technology.

In the PCB direct contacting research project (T-1753), Fraunhofer EMFT investigated PCB direct contacting systems for highly reliable mechatronic and drive technology applications. The aim was to evaluate commercially available systems in terms of technical performance, reliability and economic suitability under realistic environmental and stress conditions.

With the Soldering Mobile, the Center for Interconnection Technology in Electronics ZVE at Fraunhofer EMFT is now offering its customers an attractive alternative to onsite training courses at the Oberpfaffenhofen training center. The soldering station on wheels can be put into operation directly at the customer's premises using plug & play.

In areas where personal or security-critical data is processed in particular – such as medical technology, autonomous driving and critical infrastructures – trustworthy electronic ICT compo-nents and systems are becoming increasingly important as digitalization gathers pace. esearchers at Fraunhofer EMFT primarily focus on the hardware level here.

Every year, over 3 million immobile people worldwide suffer from severe, mostly preventable pressure ulcers, with around 0.6 million in Germany. Pressure ulcers not only cause personal suffering but are also time-consuming and costly to treat. Current prophylaxis methods require significant commitment from nursing staff and do not provide continuous security. Therefore, there is an urgent need for individual and continuous monitoring for effective pressure ulcer prophylaxis. Sorala (formerly SoreAlert), a potential spin-off from Fraunhofer EMFT, addresses this need with a smart patch that allows for automated monitoring of at-risk body areas and provides early warnings for pressure ulcers.

Edge computing is considered a key for new IoT applications. In order to bring artificial intelligence into future edge products, Fraunhofer EMFT researchers are working together with Fraunhofer IIS and Fraunhofer IPMS as part of the EU ANDANTE project to develop innovative mixed-signal artificial neural network (ANN) accelerator with computation-in-memory (CIM) ability. These are intended to enable the construction of solid hardware and software platforms for AI application development.

Nature sets a high bar: Our brain is capable of processing and storing huge amounts of information without using more energy than a 20-watt light bulb. This is a good reason for researchers worldwide to take the human brain as a model for circuits in so-called neuromorphic chips. Within the EU project NeurONN, a Fraunhofer EMFT research team is working with six European partners on extremely energy-efficient elements and architectures for neuromorphic computing. Innovative 2D materials are also being used in the process.

An advanced abatement system and exhaust gas cleaning solutions capture and reduce PFAS, NF3, and SF6 emissions in semiconductor manufacturing.

Many plasma coating systems used in the semiconductor industry have to undergo thorough cleaning on a regular basis after each stage of production. Currently this is mainly carried out using perfluorinated compounds (PFCs) and nitrogen trifluoride (NF3) gases, which are up to 17,000 times as damaging to the environment and climate as the greenhouse gas CO2. Solvay, Texas Instruments, Muegge and Fraunhofer EMFT are working on the project ecoFluor to develop an environment-friendly alternative which only has the greenhouse potential of CO2: the gas mixture used by the cooperation partners – Solvaclean®, consisting of fluorine, nitrogen and argon – dispenses entirely with the highly environmentally harmful gases PFCs and NF3.

The technology is already state of the art in modern cars: radar sensors that alert the driver when the vehicle is approaching an obstacle. Collision protection of this kind is also crucial in the future of production - smart factories in which intelligent industrial robots are expected to act completely autonomously in an increasing number of work steps - in order to ensure safe cooperation between man and machine. In the RoboMove project, Fraunhofer EMFT is working with robotics manufacturer KUKA and InnoSenT GmbH to develop an intelligent 3D distance measurement and obstacle detection system for robot arms in motion.