We encounter electrostatic discharges in everyday life more often than we would like - sometimes a seemingly harmless touch on a door handle is enough to feel the unpleasant discharges. Compared to electronic systems and technologies, however, humans react very insensitively, because even a low voltage can quickly trigger minor to serious damage, especially in high-speed technologies. This problem is exacerbated by the continuing trend towards miniaturization in microelectronics, which at the same time leads to a reduction in the maximum permissible discharge voltage. Improved ESD protection is therefore absolutely essential, especially in the environment of automated production. Load models are used to test individual components for their ESD resistance. However, common test methods are already reaching their limits in terms of accuracy and reproducibility, so that more precise measurement methods are becoming necessary.
Extensive test and measurement capabilities
For assessment and improvement of the robustness as well as the reproduction of failures, various methods for ESD testing (HBM, CDM, CC-TLP, 2Pin-Test, IEC 61000-4-2) and characterization (VF-TLP, TLP und Solid State Pulser) are applied and developed further. Examples for the latter include VF-TLP, CC-TLP and the modular CDM-Tester M-CDM3, also capable of measurements of potential distributions. Comparative physical analyses of failure signatures complement these capabilities.
A 3D portal scanner is available for determination of the functional robustness of a 30 cm component against coupled and directly injected inteference signals, as well as its radiation characteristics.