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Bending test for thin silicon substrate
Precision Manufacturing of Thin Silicon Substrate
Wafer grinding | DISCO DFG 8540 for wafers with diameter of 200 mm and 150 mm. |
Wet-chemical spin-etching | SEZ SP 203 for wafers with diameter of 200 mm and 150 mm. |
Chemo-mechanical polishing (CMP) | Avanti 472 for wafers with diameter of 200 mm and 150 mm. |
Bending and breaking test | 3-point bending, ring-ball test |
Electrical characterization during iterative bending | |
Iterative bending at defined bending radius |