Design and test methods for robust and reliable high-performance ICs

Applications in future areas such as autonomous driving, robotics and Industry 4.0 require high-performance IC components for data processing and transmission. In order to meet the rigorous demands in terms of reliability and robustness, application-specific microcontrollers or components of older production generations have mostly been used up to now – but this results in reduced performance of these systems as compared to mobile radio or computer systems with modems and CPUs of the latest production generation, which are capable of processing a vastly higher data rate. This is where the project ROBUSTNE comes in: researchers at Fraunhofer EMFT are working with TU Munich and Intel to specifically adapt the robustness and reliability of high-performance, high-volume components at critical points. 

Stress Test for the Evaluation of the Robustness of Systems
© Fraunhofer EMFT/ Bernd Müller
Stress Test for the Evaluation of the Robustness of Systems

Using the example of a current 4G/5G modem module, an efficient development method is to be elaborated that allows use of high-performance semiconductor components from the cost-sensitive consumer area in for highly reliable Industry 4.0 applications without have to undertake a costly, comprehensive redesign. 

The Fraunhofer EMFT research team is contributing its expertise in analysis and testing to the project. For this purpose, the researchers are developing test methods for modules and IC devices that identify the pulse parameters relevant to the loads in the application: these serve to extract electrical and thermal parameters for modeling and simulating the function and aging of devices based on suitable measurements. 

The project is funded by the Bavarian State Ministry of Economic Affairs, Regional Development and Energy (grant number ESB-1909-0003// ESB091/002).



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